Overview
- Discusses the general failure mechanisms of microsystems on a component level
- Comprehensive coverage of solder joint reliability at the microsystems level
- Includes accelerated testing of solder joints at the microsystems level
- Discusses quality issues and manufacturing at the microsystems level
- Includes supplementary material: sn.pub/extras
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Table of contents (11 chapters)
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Front Matter
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Back Matter
Keywords
About this book
Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.
The book also includes exercises and detailed solutions at the end of each chapter.
Authors and Affiliations
Bibliographic Information
Book Title: Reliability of Microtechnology
Book Subtitle: Interconnects, Devices and Systems
Authors: Johan Liu, Olli Salmela, Jussi Sarkka, James E. Morris, Per-Erik Tegehall, Cristina Andersson
DOI: https://doi.org/10.1007/978-1-4419-5760-3
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer Science+Business Media, LLC 2011
Hardcover ISBN: 978-1-4419-5759-7
Softcover ISBN: 978-1-4899-8211-7
eBook ISBN: 978-1-4419-5760-3
Edition Number: 1
Number of Pages: XIII, 204
Topics: Electronics and Microelectronics, Instrumentation, Optical and Electronic Materials, Quality Control, Reliability, Safety and Risk, Nanotechnology and Microengineering