Overview
- Presented in a systematic manner based on lectures and tutorials by the authors
- Focused on improved reliability in plastic packaging
- Provides theory and new industry applications
- Includes supplementary material: sn.pub/extras
Part of the book series: Micro- and Opto-Electronic Materials, Structures, and Systems (MOEM)
Access this book
Tax calculation will be finalised at checkout
Other ways to access
Table of contents(21 chapters)
About this book
Editors and Affiliations
-
Dept. Mechanical Engineering, Lamar University, Beaumont, USA
X.J. Fan
-
ERS Co., Los Altos, USA
E. Suhir
Bibliographic Information
Book Title: Moisture Sensitivity of Plastic Packages of IC Devices
Editors: X.J. Fan, E. Suhir
Series Title: Micro- and Opto-Electronic Materials, Structures, and Systems
DOI: https://doi.org/10.1007/978-1-4419-5719-1
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer Science+Business Media, LLC 2010
Hardcover ISBN: 978-1-4419-5718-4Published: 19 July 2010
Softcover ISBN: 978-1-4614-2625-7Published: 05 September 2012
eBook ISBN: 978-1-4419-5719-1Published: 23 July 2010
Series ISSN: 2626-2371
Series E-ISSN: 2626-238X
Edition Number: 1
Number of Pages: XIV, 558
Topics: Electronics and Microelectronics, Instrumentation, Optical and Electronic Materials, Engineering, general