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Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

  • Book
  • © 2000

Overview

Editors:
  1. G. Q. Zhang

    1. Philips CFT, Eindhoven, The Netherlands

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  2. L. J. Ernst

    1. Delft University of Technology, Delft, The Netherlands

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    You can also search for this editor in PubMed   Google Scholar

  3. O. Saint Leger

    1. COMPETE Network Co-ordinator at MTA, Paris, France

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Table of contents (12 chapters)

  1. Front Matter

    Pages i-x
    Download chapter PDF

  2. Simulation in the Industry

    • Bernd Schwarz, Hans Jürgen Albrecht, Gunnar Petzold, Jörg Deliga, Christian Wegener
    Pages 1-16

  3. Thermal and Mechanical Problems in Microelectronics

    • O. F. Slattery, G. Kelly, J. Greer
    Pages 17-26

  4. Solder Material Characterisation and Modelling

    • Steffen Wiese, Frank Feustel, Ekkehard Meusel
    Pages 27-36

  5. Polymer Material Characterization and Modeling

    • Leo J. Ernst
    Pages 37-58

  6. Generic Issues in Numerical Modelling

    • S. H. Pulko
    Pages 59-73

  7. Modeling of Vapor Pressure during Reflow for Electronic Packages

    • Xue-Jun Fan
    Pages 75-92

  8. Simulation for fatigue, cracks and delamination

    • Rainer Dudek, Jürgen Auersperg, Bernd Michel
    Pages 93-111

  9. Experimental validation of finite element modeling

    • Dietmar Vogel, Jian Chen, Ingrid De Wolf
    Pages 113-133

  10. Perspectives of Non-Linear Simulation

    • M. A. Crisfield, A. J. Burton
    Pages 135-149

  11. Simulation-based optimization in virtual thermo-mechanical prototyping of electronic packages

    • G. Q. Zhang, H. P. Stehouwer
    Pages 151-164

  12. Thermal Fatigue Reliability Optimisation of Flip Chip Assemblies

    • Bart Vandevelde, Eric Beyne
    Pages 165-177

  13. Product and Process Optimization with Simulation

    • Dick den Hertog, Peter Stehouwer
    Pages 179-192
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Keywords

About this book

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development.
Main areas covered are:-
  • The impact of simulation on industry profitability
  • Approaches to simulation
  • The state-of-the-art methodologies of simulation
  • Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.

    • Editors and Affiliations

    • Philips CFT, Eindhoven, The Netherlands

      G. Q. Zhang

    • Delft University of Technology, Delft, The Netherlands

      L. J. Ernst

    • COMPETE Network Co-ordinator at MTA, Paris, France

      O. Saint Leger

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