Overview
- Presents methods and techniques used for measuring and testing of the electronic materials properties
- Presents an in-depth discussion of ceramic materials for RF/MW packaging
- Presents numerical simulation methods and techniques used in analysis of electronic devices and materials
- Discusses thermal management issues for RF/MW packaging
- Presents a RF/Microwave Packaging Roadmap for Portable Devices
- Includes supplementary material: sn.pub/extras
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Table of contents (12 chapters)
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Front Matter
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Back Matter
Keywords
About this book
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Editors and Affiliations
Bibliographic Information
Book Title: RF and Microwave Microelectronics Packaging
Editors: Ken Kuang, Franklin Kim, Sean S. Cahill
DOI: https://doi.org/10.1007/978-1-4419-0984-8
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer-Verlag US 2010
Hardcover ISBN: 978-1-4419-0983-1Published: 17 November 2009
Softcover ISBN: 978-1-4899-8324-4Published: 05 September 2014
eBook ISBN: 978-1-4419-0984-8Published: 01 December 2009
Edition Number: 1
Number of Pages: XVI, 285
Topics: Electronics and Microelectronics, Instrumentation, Microwaves, RF and Optical Engineering, Circuits and Systems