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Nano-Bio- Electronic, Photonic and MEMS Packaging

  • Book
  • © 2010

Overview

Editors:
  1. C.P. Wong

    1. School of Materials Science &, Georgia Institute of Technology, Atlanta, U.S.A.

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  2. Kyoung-Sik Moon

    1. School of Materials Science &, Georgia Institute of Technology, Atlanta, U.S.A.

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    You can also search for this editor in PubMed   Google Scholar

  3. Yi (Grace) Li

    1. CH5-159, Intel Corporation, Chandler, U.S.A.

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    You can also search for this editor in PubMed   Google Scholar

  • Offers a comprehensive overview of nano and bio packaging
  • Discusses nano bio packaging materials and design with MD simulations
  • Discusses nano materials as power energy sources and their importance on the device level
  • Discusses nanotubes, superhydrophobic self-clean Lotus surfaces
  • Discusses nano packaging and thermal interfacial materials (TIMs)
  • Discusses thermal science when designing at the device level packaging
  • Covers nano chemistry for bio sensor / bio medical device packaging
  • Includes supplementary material: sn.pub/extras

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Table of contents (20 chapters)

  1. Front Matter

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  2. Nanomaterials for Microelectronic and Bio-packaging

    • C. P. Wong, Kyoung-sik (Jack) Moon
    Pages 1-17

  3. Nano-conductive Adhesives for Nano-electronics Interconnection

    • Yi Li, Kyoung-sik (Jack) Moon, C.P. Wong
    Pages 19-45

  4. Biomimetic Lotus Effect Surfaces for Nanopackaging

    • Yonghao Xiu, C.P. Wong
    Pages 47-85

  5. Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials

    • Wei Lin, C.P. Wong
    Pages 87-138

  6. Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation, and Their Electronic Applications

    • Andrew Hunt, Yongdong Jiang, Zhiyong Zhao, Ganesh Venugopal
    Pages 139-166

  7. 1D Nanowire Electrode Materials for Power Sources of Microelectronics

    • Jaephil Cho
    Pages 167-183

  8. Mechanical Energy Harvesting Using Wurtzite Nanowires

    • Xudong Wang, Zhong Lin Wang
    Pages 185-216

  9. Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging

    • Hongjin Jiang, Kyoung-sik (Jack) Moon, C.P. Wong
    Pages 217-246

  10. Introduction to Nanoparticle-Based Integrated Passives

    • Ranjith John, Ajay P. Malshe
    Pages 247-276

  11. Thermally Conductive Nanocomposites

    • Jan Felba
    Pages 277-314

  12. Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension

    • Yi Zhang, Ephraim Suhir, Claire Gu
    Pages 315-347

  13. On-Chip Thermal Management and Hot-Spot Remediation

    • Avram Bar-Cohen, Peng Wang
    Pages 349-429

  14. Some Aspects of Microchannel Heat Transfer

    • Y. Joshi, X. Wei, B. Dang, K. Kota
    Pages 431-477

  15. Nanoprobes for Live-Cell Gene Detection

    • Gang Bao, Won Jong Rhee, Andrew Tsourkas
    Pages 479-504

  16. Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips

    • Edward S. Park, Jan Krajniak, Hang Lu
    Pages 505-563

  17. Packaging of Biomolecular and Chemical Microsensors

    • Peter J. Hesketh, Xiaohui Lin
    Pages 565-611

  18. Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging

    • Dasharatham G. Janagama, Rao R. Tummala
    Pages 613-663

  19. Molecular Dynamics Applications in Packaging

    • Yao Li, Jeffrey A. Hinkley, Karl I. Jacob
    Pages 665-694

  20. Nanoscale Deformation and Strain Analysis by AFM/DIC Technique

    • Y. F. Sun, John H.L. Pang
    Pages 695-718
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Keywords

About this book

Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.

Editors and Affiliations

  • School of Materials Science &, Georgia Institute of Technology, Atlanta, U.S.A.

    C.P. Wong, Kyoung-Sik Moon

  • CH5-159, Intel Corporation, Chandler, U.S.A.

    Yi (Grace) Li

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