Overview
- The first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology
- Detailed description and working receipts (know-how) of KOH etching and anodic bonding of silicon and borosilicate glass,
- Several examples of microsystem fabrication procedures, process lay-outs, discussion of "technological kitchen" based on author’s own laboratorial experience, rich literature data
- Hundreds of pictures and photographs suitable for teaching of microsystem technology and better accommodation of the material by students
- Can be read by non-specialists to understand what microsystems and their applications are
Part of the book series: Springer Series in Advanced Microelectronics (MICROELECTR., volume 24)
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Table of contents (5 chapters)
Keywords
About this book
Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author’s personal experience.
Reviews
From the reviews:
"Any one interested in bonding in microsystem technology will likely be well served by this outstanding volume which is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. … Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students." (Current Engineering Practice, 2007)
Authors and Affiliations
Bibliographic Information
Book Title: Bonding in Microsystem Technology
Authors: Jan A. Dziuban
Series Title: Springer Series in Advanced Microelectronics
DOI: https://doi.org/10.1007/1-4020-4589-1
Publisher: Springer Dordrecht
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer Science+Business Media B.V. 2006
Hardcover ISBN: 978-1-4020-4578-3Published: 13 June 2006
Softcover ISBN: 978-90-481-7151-4Published: 25 November 2010
eBook ISBN: 978-1-4020-4589-9Published: 30 January 2007
Series ISSN: 1437-0387
Series E-ISSN: 2197-6643
Edition Number: 1
Number of Pages: XVIII, 334
Topics: Solid Mechanics, Engineering, general, Optical and Electronic Materials, Electronics and Microelectronics, Instrumentation, Manufacturing, Machines, Tools, Processes