Skip to main content
SpringerLink
Log in

Fine Pitch Surface Mount Technology

Quality, Design, and Manufacturing Techniques

  • Book
  • © 1992

Overview

Authors:
  1. Phil P. Marcoux

    1. PPM Associates, Inc., Sunnyvale, USA

    View author publications

    You can also search for this author in PubMed   Google Scholar

This is a preview of subscription content, log in via an institution to check access.

Access this book

Log in via an institution
eBook USD 169.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book USD 219.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book USD 219.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access

Licence this eBook for your library

Institutional subscriptions

Table of contents (13 chapters)

  1. Front Matter

    Pages i-xi
    Download chapter PDF

  2. Introduction to Fine Pitch Technology (FPT)

    • Phil P. Marcoux
    Pages 1-28

  3. The Family of FPT Packages

    • Phil P. Marcoux
    Pages 29-67

  4. Fine Pitch Product Applications

    • Phil P. Marcoux
    Pages 68-75

  5. Printed Circuit Boards for Fine Pitch Technology

    • Phil P. Marcoux
    Pages 76-106

  6. Solder and Application Methods

    • Phil P. Marcoux
    Pages 107-148

  7. Package Placement

    • Phil P. Marcoux
    Pages 149-168

  8. Solder Reflow

    • Phil P. Marcoux
    Pages 169-199

  9. Post Reflow Cleaning

    • Phil P. Marcoux
    Pages 200-205

  10. Inspection, Rework, and Repair

    • Phil P. Marcoux
    Pages 206-217

  11. Design for Reliability Guidelines

    • Phil P. Marcoux
    Pages 218-240

  12. Design for Testability

    • Phil P. Marcoux
    Pages 241-264

  13. Design for Manufacturability

    • Phil P. Marcoux
    Pages 265-283

  14. Specific Design Guidelines for FPT Packages

    • Phil P. Marcoux
    Pages 284-318

  15. Back Matter

    Pages 319-340
    Download chapter PDF
Back to top

Keywords

About this book

Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.

Authors and Affiliations

  • PPM Associates, Inc., Sunnyvale, USA

    Phil P. Marcoux

Bibliographic Information

  • Book Title: Fine Pitch Surface Mount Technology

  • Book Subtitle: Quality, Design, and Manufacturing Techniques

  • Authors: Phil P. Marcoux

  • DOI: https://doi.org/10.1007/978-1-4615-3532-4

  • Publisher: Springer New York, NY

  • eBook Packages: Springer Book Archive

  • Copyright Information: Springer Science+Business Media New York 1992

  • Hardcover ISBN: 978-0-442-00862-8Published: 31 July 1992

  • Softcover ISBN: 978-1-4613-6567-9Published: 23 February 2014

  • eBook ISBN: 978-1-4615-3532-4Published: 27 November 2013

  • Edition Number: 1

  • Number of Pages: XI, 340

  • Number of Illustrations: 173 b/w illustrations

  • Topics: Circuits and Systems, Control Structures and Microprogramming, Manufacturing, Machines, Tools, Processes, Electrical Engineering

Publish with us

Policies and ethics

Back to top

Search

Navigation