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Micro-Assembly Technologies and Applications

IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS'2008) Chamonix, France, February 10-13, 2008

  • Conference proceedings
  • © 2008

Overview

Editors:
  1. Svetan Ratchev

    1. University of Nottingham, UK

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  2. Sandra Koelemeijer

    1. École Polytechnique Fédérale de Lausanne, Switzerland

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  • The papers in this volume were peer-reviewed and carefully selected
  • Much information in this series is published in advance of journal publication
  • The contributors in this volume are world-renowned experts in their field

Part of the book series: IFIP Advances in Information and Communication Technology (IFIPAICT, volume 260)

Included in the following conference series:

Conference proceedings info: IPAS 2008.

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Table of contents (40 papers)

  1. Front Matter

    Pages i-xiii
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  2. Design of Micro Products

    1. Front Matter

      Pages 1-1
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    2. Methods of Design for Micro-Assembly

      1. Application of a DFμA Methodology to facilitate the assembly of a Micro/Nano Measurement Device
        • Carsten Tietje, Richard Leach, Michele Turitto, Ronaldo Ronaldo, Svetan Ratchev
        Pages 5-12
      2. A DFA Framework for Hybrid Microsystems
        • Marcel Tichem, Dafina Tanase
        Pages 13-22
      3. Statistical Assemblies with form Errors — A 2D Example
        • Pierre-Antoine Adragna, Hugues Favrelière, Serge Samper, Maurice Pillet
        Pages 23-33

    3. Methods and Solutions for Micro-Product Design

      1. A Classification and Coding System for Micro-Assembly
        • Amar Kumar Behera, Shiv G. Kapoor, Richard E. DeVor
        Pages 37-53
      2. A Method for Three Dimensional Tolerance Analysis and Synthesis Applied to Complex and Precise Assemblies
        • Frédéric Germain, Dimitri Denimal, Max Giordano
        Pages 55-65
      3. New Designs for Submillimetric Press-Fitting
        • Ludovic Charvier, Fabien Bourgeois, Jacques Jacot, Grégoire Genolet, Hubert Lorenz
        Pages 67-74
      4. Design and Testing of an Ortho-Planar Micro-Valve
        • O. Smal, B. Raucent, F. Ceyssens, R. Puers, M. De Volder, D. Reynaerts
        Pages 75-86
      5. Robust Design of a Lens System of Variable Refraction Power with Respect to the Assembly Process
        • Ingo Sieber, Ulrich Gengenbach, Rudolf Scharnowell
        Pages 87-93

  3. Micro-Assembly Processes and Applications

    1. Front Matter

      Pages 95-95
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    3. High Precision Packaging and Assembly Processes

      1. Adaptive Packaging Solution for a Microlens Array Placed Over a Micro-UV-LED Array
        • Markus Luetzelschwab, Dominik Weiland, Marc P. Y. Desmulliez
        Pages 129-138
      2. Solder Bumping — A Flexible Joining Approach for the Precision Assembly of Optoelectronical Systems
        • Erik Beckert, Thomas Burkhardt, Ramona Eberhardt, Andreas Tünnermann
        Pages 139-147
      3. Fluidassem - A New Method of Fluidic-Based Assembly with Surface Tension
        • N. Boufercha, J. Sägebarth, M. Burgard, N. Othman, D. Schlenker, W. Schäfer et al.
        Pages 149-159
      4. Concepts for Hybrid Micro Assembly Using Hot Melt Joining
        • Sven Rathmann, Annika Raatz, Jürgen Hesselbach
        Pages 161-169
      5. Application of Microstereolithography Technology in Micromanufacturing
        • Hongyi Yang, Gregory Tsiklos, Ronaldo Ronaldo, Svetan Ratchev
        Pages 171-176
      6. In Situ Microassembly
        • Ronaldo Ronaldo, Thomas Papastathis, Hongyi Yang, Carsten Tietje, Michele Turitto, Svetan Ratchev
        Pages 177-185
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  1. Micro-Assembly Technologies and Applications

Keywords

About this book

Micro-assembly is a key enabling technology for cost effective manufacture of new generations of complex micro products. It is also a critical technology for retaining mdustrial capabilities in high labour cost areas such as Europe since up to 80% of the production cost in some industries is attributed directly to assembly processes. With the continuous trend for product miniaturisation, the scientific and technologi­ cal developments in micro-assembly are expected to have a significant long-term economic, demographic and social impact. A distinctive feature of the process is that surface forces are often dominant over gravity forces, which determines a number of specific technical challenges. Critical areas which are currently being addressed include development of assembly systems with high positional accuracy, micro gripping methods that take into ac­ count the adhesive surface forces, high precision micro-feeding techniques and mi­ cro-joining processes. Micro-assembly has developed rapidly over the last few years and all the pre­ dictions are that it will remain a critical technology for high value products in a number of key sectors such as healthcare, communications, defence and aerospace. The key challenge is to match the significant technological developments with a new generation of micro products that will establish firmly micro-assembly as a core manufacturing process.

Editors and Affiliations

  • University of Nottingham, UK

    Svetan Ratchev

  • École Polytechnique Fédérale de Lausanne, Switzerland

    Sandra Koelemeijer

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