Editors:
- Offers a comprehensive discussion of Nanoparticles and Carbon Nanotubes, and how and why they are rapidly becoming materials options for electronics packaging
- Discusses the importance of computer modeling in nanopackaging and offers suggestions for implementation
- Discusses Nanoparticles and their role in packaging, including basic properties and fabrication, and applications in resistors, capacitors, inductors, microvias and conductive adhesives, solder, underfill, and thermal management
- Discusses Carbon Nanotubes and their role in packaging, including basic properties and fabrication, and applications in solder, thermal management, and EMI control
- Brings together a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends
- Includes supplementary material: sn.pub/extras
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Table of contents (24 chapters)
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Front Matter
About this book
Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. “Nanopackaging” is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.
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Editors and Affiliations
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Dept. Electrical &, Computer Engineering, Portland State University, Portland, USA
James E. Morris
Bibliographic Information
Book Title: Nanopackaging
Book Subtitle: Nanotechnologies and Electronics Packaging
Editors: James E. Morris
DOI: https://doi.org/10.1007/978-0-387-47325-3
Publisher: Springer New York, NY
eBook Packages: Chemistry and Materials Science, Chemistry and Material Science (R0)
Copyright Information: Springer-Verlag US 2008
Hardcover ISBN: 978-0-387-47325-3Published: 23 October 2008
eBook ISBN: 978-0-387-47326-0Published: 30 December 2008
Edition Number: 1
Number of Pages: XXI, 543
Topics: Nanotechnology, Electrochemistry, Electronics and Microelectronics, Instrumentation