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Ambient Intelligence with Microsystems

Augmented Materials and Smart Objects

Authors:

  • Bridges the gap between microsystems research and the new challenges presented by concepts such as Ambient Intelligence, the Disappearing Computer, and Cooperating Objects
  • Provides a practical approach to the realization of ambient intelligence concepts and discusses the road mapping and scenario development initiatives
  • Investigates the specific implications for the emerging microsystems technologies that will need to be integrated into internet-like heterogeneous systems
  • Analyses the impact of the trend towards embedded microelectronic sub-systems and novel assembly techniques for autonomous MEMs sensors
  • Discusses current requirements for realizing applications-oriented examples of smart objects
  • Reviews new approaches and initiatives in collaborative research that are leading to innovation in both the hardware and software domains. Provides a practical (i.e. based upon demonstrable platforms, prototypes and field trial systems) perspective in reviewing and discussing what has been achieved to date

Part of the book series: Microsystems (MICT, volume 18)

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Table of contents (18 chapters)

  1. Front Matter

    Pages i-xiv
  2. The Concepts

    1. Front Matter

      Pages 1-2
    2. An Overview of Pervasive Computing Systems

      • Juan Ye, Simon Dobson, Paddy Nixon
      Pages 3-17
    3. Augmenting Materials to Build Cooperating Objects

      • Kieran Delaney, Simon Dobson
      Pages 19-46
  3. Device Technologies

    1. Front Matter

      Pages 47-48
    2. Overview of Component Level Devices

      • Erik Jung
      Pages 49-79
  4. Hardware Sub-Systems Technologies

    1. Front Matter

      Pages 101-103
    2. Distributed, Embedded Sensor and Actuator Platforms

      • John Barton, Erik Jung
      Pages 105-129
    3. Embedded Microelectronic Subsystems

      • John Barton
      Pages 131-153
  5. Networking Technologies

    1. Front Matter

      Pages 155-156
    2. Embedded Wireless Networking: Principles, Protocols, and Standards

      • Dirk Pesch, Susan Rea, Andreas Timm-Giel
      Pages 157-184
  6. Systems Technologies

    1. Front Matter

      Pages 185-186
    2. Context in Pervasive Environments

      • Donna Griffin, Dirk Pesch
      Pages 187-203
  7. System-Level Challenges

    1. Front Matter

      Pages 239-240
    2. Power Management, Energy Conversion and Energy Scavenging for Smart Systems

      • Terence O’Donnell, Wensi Wang
      Pages 241-266
  8. System Co-Design

    1. Front Matter

      Pages 283-284
    2. Co-Design: From Electronic Substrates to Smart Objects

      • Kieran Delaney, Jian Liang
      Pages 285-296

About this book

Augmented Materials and Smart Objects investigates the issues required to ensure technology platforms capable of being seamlessly integrated into everyday objects, particularly the requirements for integrated computation and MEMs sensors, System-in-a-package solutions, multi-chip modules, the impact of the trend towards embedded microelectronic electronics sub-systems, novel assembly techniques for autonomous MEMs sensors, as well as practical performance issues that are key to the AmI concept.

Also discussed are current requirements for realizing applications-oriented examples of smart objects (e.g. smart textiles, gadgets, integration of smart systems for utility and environmental monitoring, etc); these are based upon heterogeneous systems linking networks of sensors attached to (or physically embedded in) objects with information management systems enabling collections of smart objects to collaborate to provide proactive services to the user.

Finally, Augmented Materials and Smart Objects describes and discusses a number of vision statements strongly relevant to the future development of distributed embedded sensor and actuator platforms for smart objects, and ultimately Ambient Intelligence. The framework for this is the concept of Augmented Materials; these are materials with fully embedded distributed information systems, designed to measure all relevant physical properties and provide a full knowledge representation of the material; in effect, the material would "know" itself, and its current status.

Authors and Affiliations

  • Department of Electronic Engineering, Cork Institute of Technology, Bishoptown, Cork, Ireland

    Kieran Delaney

Bibliographic Information

Buy it now

Buying options

eBook USD 129.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book USD 169.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book USD 169.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access