Overview
- Focuses on process integration techniques and technology
- Addresses both raw silicon material and demonstrates their use in components
- Includes supplementary material: sn.pub/extras
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Table of contents (8 chapters)
Keywords
About this book
Silicon Devices and Process Integration covers state-of-the-art silicon devices, their characteristics, and their interactions with process parameters. It serves as a comprehensive guide which addresses both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. The book is compiled from the author’s industrial and academic lecture notes and reflects years of experience in the development of silicon devices.
Features include:
- A review of silicon properties which provides a foundation for understanding the device properties discussion, including mobility-enhancement by straining silicon;
- State-of-the-art technologies on high-K gate dielectrics, low-K dielectrics, Cu interconnects, and SiGe BiCMOS;
- CMOS-only applications, such as subthreshold current and parasitic latch-up;
- Advanced Enabling processes and process integration.
This book is written for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.
Authors and Affiliations
Bibliographic Information
Book Title: Silicon Devices and Process Integration
Book Subtitle: Deep Submicron and Nano-Scale Technologies
Authors: Badih El-Kareh
DOI: https://doi.org/10.1007/978-0-387-69010-0
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer-Verlag US 2009
Hardcover ISBN: 978-0-387-36798-9Published: 12 January 2009
Softcover ISBN: 978-1-4419-4224-1Published: 29 October 2010
eBook ISBN: 978-0-387-69010-0Published: 09 January 2009
Edition Number: 1
Number of Pages: XXVI, 598
Topics: Circuits and Systems, Electronics and Microelectronics, Instrumentation, Electrical Engineering, Materials Science, general