Skip to main content
SpringerLink
Log in
Book cover

High Thermal Conductivity Materials

  • Book
  • © 2006

Overview

Editors:
  1. Subhash L. Shindé

    1. Sandia National Labs, Albuquerque, USA

    View editor publications

    You can also search for this editor in PubMed   Google Scholar

  2. Jitendra S. Goela

    1. Rohm and Haas Advanced Materials, Woburn, USA

    View editor publications

    You can also search for this editor in PubMed   Google Scholar

  • Covers the basic understanding of thermal conduction mechanisms in various high thermal conductivity materials including diamond, cubic boron nitride, and also the latest material like carbon nanotubes

  • Intended as a good reference book for scientists and engineers involved in addressing thermal management issues in a broad spectrum of industries

  • Leading researchers from industry and academic institutions who are well known in their areas of expertise have contributed a chapter in the field of their interest

  • Includes supplementary material: sn.pub/extras

This is a preview of subscription content, log in via an institution to check access.

Access this book

Log in via an institution
eBook USD 129.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book USD 169.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book USD 169.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access

Licence this eBook for your library

Institutional subscriptions

Table of contents (8 chapters)

  1. Front Matter

    Pages i-xviii
    Download chapter PDF

  2. Lattice Thermal Conduction Mechanism in Solids

    • G.P. Srivastava
    Pages 1-35

  3. High Lattice Thermal Conductivity Solids

    • Donald T. Morelli, Glen A. Slack
    Pages 37-68

  4. Thermal Characterization of the High-Thermal-Conductivity Dielectrics

    • Yizhang Yang, Sadegh M. Sadeghipour, Wenjun Liu, Mehdi Asheghi, Maxat Touzelbaev
    Pages 69-118

  5. Thermal Wave Probing of High-Conductivity Heterogeneous Materials

    • Danièle Fournier
    Pages 119-142

  6. Fabrication of High-Thermal-Conductivity Polycrystalline Aluminum Nitride: Thermodynamic and Kinetic Aspects of Oxygen Removal

    • Anil V. Virkar, Raymond A. Cutler
    Pages 143-166

  7. High-Thermal-Conductivity SiC and Applications

    • J.S. Goela, N.E. Brese, L.E. Burns, M.A. Pickering
    Pages 167-198

  8. Chemical-Vapor-Deposited Diamond for High-Heat-Transfer Applications

    • J.S. Goela, J.E. Graebner
    Pages 199-226

  9. Unusually High Thermal Conductivity in Carbon Nanotubes

    • Young-Kyun Kwon, Philip Kim
    Pages 227-265

  10. Back Matter

    Pages 267-271
    Download chapter PDF
Back to top

Keywords

About this book

Thedemandfore?cientthermalmanagementhasincreasedsubstantiallyover the last decade in every imaginable area, be it a formula 1 racing car suddenly braking to decelerate from 200 to 50 mph going around a sharp corner, a space shuttle entering the earth’s atmosphere, or an advanced microproc- sor operating at a very high speed. The temperatures at the hot junctions are extremely high and the thermal ?ux can reach values higher than a few 2 hundred to a thousand watts/cm in these applications. To take a speci?c example of the microelectronics area, the chip heat ?ux for CMOS microp- cessors, though moderate compared to the numbers mentioned above have 2 already reached values close to 100 W/cm , and are projected to increase 2 above 200 W/cm over the next few years. Although the thermal mana- ment strategies for microprocessors do involve power optimization through improved design, it is extremely di?cult to eliminate “hot spots” completely. This is where high thermal conductivity materials ?nd most of their appli- tions, as “heat spreaders”. The high thermal conductivity of these materials allows the heat to be carried away from the “hot spots” very quickly in all directions thereby “spreading” the heat. Heat spreading reduces the heat ?ux density, and thus makes it possible to cool systems using standard cooling solutions like ?nned heat sinks with forced air cooling.

Editors and Affiliations

  • Sandia National Labs, Albuquerque, USA

    Subhash L. Shindé

  • Rohm and Haas Advanced Materials, Woburn, USA

    Jitendra S. Goela

Bibliographic Information

  • Book Title: High Thermal Conductivity Materials

  • Editors: Subhash L. Shindé, Jitendra S. Goela

  • DOI: https://doi.org/10.1007/b106785

  • Publisher: Springer New York, NY

  • eBook Packages: Physics and Astronomy, Physics and Astronomy (R0)

  • Copyright Information: Springer-Verlag New York 2006

  • Hardcover ISBN: 978-0-387-22021-5Published: 16 November 2005

  • Softcover ISBN: 978-1-4419-1956-4Published: 06 October 2010

  • eBook ISBN: 978-0-387-25100-4Published: 31 January 2006

  • Edition Number: 1

  • Number of Pages: XVIII, 271

  • Number of Illustrations: 133 b/w illustrations

  • Topics: Condensed Matter Physics, Characterization and Evaluation of Materials

Publish with us

Policies and ethics

Back to top

Search

Navigation