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Table of contents (7 chapters)
Keywords
About this book
Besides the trivial solutions that are often used to solve this problem, there are many more methods that enable significant optimizations of test vector length and/or diagnostic resolution. The book surveys all existing methods of this kind and proposes new ones. In the new approach circuit and interconnect faults are carefully modeled, and graph techniques are applied to solve the problem. The original feature of the new method is the fact that it can be adjusted to provide shorter test sequences and/or greater diagnostic resolution. The effectiveness of existing and proposed methods is then evaluated using real electronic assemblies and published statistical data for an actual manufacturing process from HP.
Authors and Affiliations
Bibliographic Information
Book Title: Boundary-Scan Interconnect Diagnosis
Authors: José T. Sousa, Peter Y. K. Cheung
Series Title: Frontiers in Electronic Testing
DOI: https://doi.org/10.1007/b100750
Publisher: Springer New York, NY
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eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media New York 2001
Hardcover ISBN: 978-0-7923-7314-8Published: 28 February 2001
Softcover ISBN: 978-1-4419-4887-8Published: 07 December 2010
eBook ISBN: 978-0-306-47975-5Published: 28 December 2005
Series ISSN: 0929-1296
Edition Number: 1
Number of Pages: XXI, 168