SpringerBriefs in Reliability

Electromigration Modeling at Circuit Layout Level

Authors: Tan, Cher Ming, He, Feifei

  • Highlights a new method which models the interconnects EM reliability in both 3D and circuit layout level
  • Combines Cadence and ANSYS softwares to model interconnect reliability of real 3D circuit made up of complete interconnect structures and surrounding materials
  • Compares the circuit EM lifetime with different interconnect structures, surrounding materials, circuit layout and process variations
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eBook $34.99
price for USA (gross)
  • ISBN 978-981-4451-21-5
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Softcover $49.95
price for USA
  • ISBN 978-981-4451-20-8
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Rent the ebook  
  • Rental duration: 1 or 6 month
  • low-cost access
  • online reader with highlighting and note-making option
  • can be used across all devices
About this book

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

Table of contents (5 chapters)

  • Introduction

    Tan, Cher Ming (et al.)

    Pages 1-6

  • 3D Circuit Model Construction and Simulation

    Tan, Cher Ming (et al.)

    Pages 7-47

  • Comparison of EM Performances in Circuit and Test Structures

    Tan, Cher Ming (et al.)

    Pages 49-74

  • Interconnect EM Reliability Modeling at Circuit Layout Level

    Tan, Cher Ming (et al.)

    Pages 75-99

  • Concluding Remarks

    Tan, Cher Ming (et al.)

    Pages 101-103

Buy this book

eBook $34.99
price for USA (gross)
  • ISBN 978-981-4451-21-5
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Softcover $49.95
price for USA
  • ISBN 978-981-4451-20-8
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Rent the ebook  
  • Rental duration: 1 or 6 month
  • low-cost access
  • online reader with highlighting and note-making option
  • can be used across all devices
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Bibliographic Information

Bibliographic Information
Book Title
Electromigration Modeling at Circuit Layout Level
Authors
Series Title
SpringerBriefs in Reliability
Copyright
2013
Publisher
Springer Singapore
Copyright Holder
The Author(s)
eBook ISBN
978-981-4451-21-5
DOI
10.1007/978-981-4451-21-5
Softcover ISBN
978-981-4451-20-8
Series ISSN
2196-1123
Edition Number
1
Number of Pages
IX, 103
Number of Illustrations and Tables
73 b/w illustrations, 2 illustrations in colour
Topics