Overview
- Nominated by Tsinghua University as an outstanding thesis in the field
- Includes a detailed experimental analysis of the surface characterization of Cu interconnects
- Presents advanced experimental methods for investigating Cu/Ru micro-galvanic corrosion
- Explains the experimental results in detail
Part of the book series: Springer Theses (Springer Theses)
Access this book
Tax calculation will be finalised at checkout
Other ways to access
Table of contents(8 chapters)
About this book
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.
Authors and Affiliations
-
Tsinghua University , Beijing, China
Jie Cheng
Bibliographic Information
Book Title: Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Authors: Jie Cheng
Series Title: Springer Theses
DOI: https://doi.org/10.1007/978-981-10-6165-3
Publisher: Springer Singapore
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer Nature Singapore Pte Ltd. 2018
Hardcover ISBN: 978-981-10-6164-6Published: 18 September 2017
Softcover ISBN: 978-981-13-5585-1Published: 30 January 2019
eBook ISBN: 978-981-10-6165-3Published: 06 September 2017
Series ISSN: 2190-5053
Series E-ISSN: 2190-5061
Edition Number: 1
Number of Pages: XVIII, 137
Number of Illustrations: 103 b/w illustrations
Topics: Manufacturing, Machines, Tools, Processes, Tribology, Corrosion and Coatings, Electronics and Microelectronics, Instrumentation