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Solder Paste in Electronics Packaging

Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

  • Book
  • © 1989

Overview

Authors:
  1. Jennie S. Hwang

    1. SCM Metal Products, Inc., USA

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Table of contents (16 chapters)

  1. Front Matter

    Pages i-xxiii
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  2. Overview

    1. Front Matter

      Pages 1-1
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    2. Introduction

      • Jennie S. Hwang
      Pages 3-21

    3. Interdisciplinary Approach

      • Jennie S. Hwang
      Pages 23-29

  3. Basic Technologies

    1. Front Matter

      Pages 31-31
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    2. Chemical and Physical Characteristics

      • Jennie S. Hwang
      Pages 33-70

    3. Metallurgical Aspects

      • Jennie S. Hwang
      Pages 71-121

    4. Rheology of Solder Pastes

      • Jennie S. Hwang
      Pages 123-149

  4. Methodologies and Applications

    1. Front Matter

      Pages 151-151
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    2. Application Techniques

      • Jennie S. Hwang
      Pages 153-181

    3. Soldering Methodologies

      • Jennie S. Hwang
      Pages 183-221

    4. Cleaning

      • Jennie S. Hwang
      Pages 223-257

  5. Reliability, Quality Control and Tests

    1. Front Matter

      Pages 259-259
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    2. Solder Joint Reliability and Inspection

      • Jennie S. Hwang
      Pages 261-304

    3. Special Topics in Surface Mount Soldering Problems and Other Soldering-Related Problems

      • Jennie S. Hwang
      Pages 305-328

    4. Quality Assurance and Tests

      • Jennie S. Hwang
      Pages 329-356

  6. Future Tasks and Emerging Trends

    1. Front Matter

      Pages 357-357
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    2. Future Developments

      • Jennie S. Hwang
      Pages 359-365

  7. Appendix

    1. Front Matter

      Pages 367-367
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    2. Federal Specification QQ-S-571E and Amendment 4

      • Jennie S. Hwang
      Pages 369-396
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Keywords

About this book

One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech­ nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo­ dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation­ ships between these characteristics are clearly explained and pre­ sented. In this excellent presentation, Dr. Hwang highlights three impor­ tant areas of solder paste technology.

Authors and Affiliations

  • SCM Metal Products, Inc., USA

    Jennie S. Hwang

Bibliographic Information

  • Book Title: Solder Paste in Electronics Packaging

  • Book Subtitle: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

  • Authors: Jennie S. Hwang

  • DOI: https://doi.org/10.1007/978-94-011-6050-6

  • Publisher: Springer Dordrecht

  • eBook Packages: Springer Book Archive

  • Copyright Information: Van Nostrand Reinhold 1989

  • Softcover ISBN: 978-94-011-6052-0Published: 20 February 2012

  • eBook ISBN: 978-94-011-6050-6Published: 06 December 2012

  • Edition Number: 1

  • Number of Pages: XXIV, 456

  • Topics: Science, Humanities and Social Sciences, multidisciplinary

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