SpringerBriefs in Applied Sciences and Technology

Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System

Authors: Samukawa, Seiji

  • Is the first book that focuses on an etching profile prediction system from a practical application viewpoint
  • Explains the development of an effective on-wafer UV sensor, on-wafer charge-up sensor, and on-wafer sheath shape sensor
  • Contributes to a better understanding of etching profile prediction systems, including several experimental findings
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eBook $39.99
price for USA (gross)
  • ISBN 978-4-431-54795-2
  • Digitally watermarked, DRM-free
  • Included format: PDF, EPUB
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Softcover $54.99
price for USA
  • ISBN 978-4-431-54794-5
  • with online files
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Rent the ebook  
  • Rental duration: 1 or 6 month
  • low-cost access
  • online reader with highlighting and note-making option
  • can be used across all devices
About this book

This book provides for the first time a good understanding of the etching profile technologies that do not disturb the plasma. Three types of sensors are introduced: on-wafer UV sensors, on-wafer charge-up sensors and on-wafer sheath-shape sensors in the plasma processing and prediction system of real etching profiles based on monitoring data. Readers are made familiar with these sensors, which can measure real plasma process surface conditions such as defect generations due to UV-irradiation, ion flight direction due to charge-up voltage in high-aspect ratio structures and ion sheath conditions at the plasma/surface interface. The plasma etching profile realistically predicted by a computer simulation based on output data from these sensors is described.

About the authors

Prof. Seiji Samukawa
Distinguished Professor in Tohoku University
Professor in Institute of Fluid Science,
Professor and Principal Investigator, WPI-AIMR in Tohoku University.

Table of contents (4 chapters)

  • Introduction

    Samukawa, Seiji

    Pages 1-4

  • On-wafer UV Sensor and Prediction of UV Irradiation Damage

    Samukawa, Seiji

    Pages 5-18

  • Prediction of Abnormal Etching Profiles in High-Aspect-Ratio Via/Hole Etching Using On-wafer Monitoring System

    Samukawa, Seiji

    Pages 19-31

  • Feature Profile Evolution in Plasma Processing Using Wireless On-wafer Monitoring System

    Samukawa, Seiji

    Pages 33-38

Buy this book

eBook $39.99
price for USA (gross)
  • ISBN 978-4-431-54795-2
  • Digitally watermarked, DRM-free
  • Included format: PDF, EPUB
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Softcover $54.99
price for USA
  • ISBN 978-4-431-54794-5
  • with online files
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Rent the ebook  
  • Rental duration: 1 or 6 month
  • low-cost access
  • online reader with highlighting and note-making option
  • can be used across all devices
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Bibliographic Information

Bibliographic Information
Book Title
Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System
Authors
Series Title
SpringerBriefs in Applied Sciences and Technology
Copyright
2014
Publisher
Springer Japan
Copyright Holder
The Author(s)
eBook ISBN
978-4-431-54795-2
DOI
10.1007/978-4-431-54795-2
Softcover ISBN
978-4-431-54794-5
Series ISSN
2191-530X
Edition Number
1
Number of Pages
VIII, 40
Number of Illustrations and Tables
5 b/w illustrations, 30 illustrations in colour
Topics