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IFIP Advances in Information and Communication Technology

Embedded Systems: Design, Analysis and Verification

4th IFIP TC 10 International Embedded Systems Symposium, IESS 2013, Paderborn, Germany, June 17-19, 2013, Proceedings

Editors: Schirner, G., Götz, M., Rettberg, A., Zanella, M.C., Rammig, F.J. (Eds.)

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eBook $99.00
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About this book

This book constitutes the refereed proceedings of the 4th IFIP TC 10 International Embedded Systems Symposium, IESS 2013, held in Paderborn, Germany, in June 2013. The 22 full revised papers presented together with 8 short papers were carefully reviewed and selected from 42 submissions. The papers have been organized in the following topical sections: design methodologies; non-functional aspects of embedded systems; verification; performance analysis; real-time systems; embedded system applications; and real-time aspects in distributed systems. The book also includes a special chapter dedicated to the BMBF funded ARAMIS project on Automotive, Railway and Avionics Multicore Systems.

Table of contents (31 chapters)

  • TECSCE: HW/SW Codesign Framework for Data Parallelism Based on Software Component

    Azumi, Takuya (et al.)

    Pages 1-13

  • Programming Robots with Events

    Le, Truong-Giang (et al.)

    Pages 14-25

  • Joint Algorithm Developing and System-Level Design: Case Study on Video Encoding

    Zhang, Jiaxing (et al.)

    Pages 26-38

  • Automatic Execution of Test Cases on UML Models of Embedded Systems

    Wehrmeister, Marco A. (et al.)

    Pages 39-48

  • Compiler Optimizations Do Impact the Reliability of Control-Flow Radiation Hardened Embedded Software

    Parizi, Rafael B. (et al.)

    Pages 49-60

Buy this book

eBook $99.00
price for USA (gross)
  • ISBN 978-3-642-38853-8
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $129.00
price for USA
  • ISBN 978-3-642-38852-1
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $129.00
price for USA
  • ISBN 978-3-642-43028-2
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Embedded Systems: Design, Analysis and Verification
Book Subtitle
4th IFIP TC 10 International Embedded Systems Symposium, IESS 2013, Paderborn, Germany, June 17-19, 2013, Proceedings
Editors
  • Gunar Schirner
  • Marcelo Götz
  • Achim Rettberg
  • Mauro C. Zanella
  • Franz J. Rammig
Series Title
IFIP Advances in Information and Communication Technology
Series Volume
403
Copyright
2013
Publisher
Springer-Verlag Berlin Heidelberg
Copyright Holder
IFIP International Federation for Information Processing
eBook ISBN
978-3-642-38853-8
DOI
10.1007/978-3-642-38853-8
Hardcover ISBN
978-3-642-38852-1
Softcover ISBN
978-3-642-43028-2
Series ISSN
1868-4238
Edition Number
1
Number of Pages
XIV, 354
Number of Illustrations and Tables
136 b/w illustrations
Topics