Bio and Nano Packaging Techniques for Electron Devices

Advances in Electronic Device Packaging

Editors: Gerlach, Gerald, Wolter, Klaus-Jürgen (Eds.)

  • Provides solutions for electron device packaging
  • Comprehensive review of nanoscale materials for packaging
  • Lists the future trends in nanobiotechniques
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eBook $119.00
price for USA (gross)
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  • ISBN 978-3-642-28522-6
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Hardcover $159.00
price for USA
valid through November 5, 2017
  • ISBN 978-3-642-28521-9
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $159.00
price for USA
valid through November 5, 2017
  • ISBN 978-3-642-44286-5
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
About this book

This book discusses future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes the effect of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their application as packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed; also ways for implementation are described. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces as well as new packaging technologies with high potential for industrial applications are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers.

About the authors

Prof. Dr.-Ing. habil. Gerald Gerlach:

1983, 1987 Diploma and doctoral degree in EE from Technische Universität Dresden, Germany, respectively R&D engineer in measuring devices industry. Since 1993 Professor for Microtechnology, since 1996 Professor for Solid State Electronics in EE department of TU Dresden. 2001/02 Visiting professor at UCLA. Since 2002 Member of the Executive of VDE (German Association of Engineers in Electrical Engineering, Electronics, Information Technology). Since 2007 Chairperson of the German Society for Measurement and Automatic Control (GMA). Since 1996 Conference Chairman of the biannually organised International Conference „Infrared Sensors and Systems IRS2" in Nuremberg (in conjunction with the world’s largest sensor exhibition "Sensor+Test"). 2008 General Chairman of the Eurosensors XXII Conference, Dresden. Author and Co-author of some 280 scientific journal and international conference papers, holds more than 40 patents.

Prof. Dr.-Ing. habil. Klaus-Juergen Wolter: 1967-1973 Studies in Control Theory at the Technical University Kiev, Ukraine. 1983 Dissertation "Correlation method for vision systems in microelectronics assembly". 1987 University Teaching Qualification (Habilitation). 1989-1973 R&D position the microelectronics industry. 1989 Assistant professor at the Institute of Electronic Technology. 1992 Appointment as Chair of Procedure Technology of Electronics. 1998 – 1999 Sabbatical at Tessera, San Jose, CA, (Wafer-Level-Packaging). Since 2002 Director of the Centre of Microtechnical Manufacturing (ZµP) at TUD. Since 2003 Director of the Electronic Packaging Lab at Dresden University of Technology. Since 2006 Deputy Head at Fraunhofer Institute IZFP Dresden.
Fields of research: Substrate technologies, Assembly technologies of devices, components, MEMS, Joining technologies, Reliability of electronic packages, Non-destructive test methods

Table of contents (30 chapters)

  • Packaging for Electronic Systems

    Gerlach, Gerald

    Pages 3-30

  • System Integration by Advanced Electronics Packaging

    Wolter, Klaus-Jürgen

    Pages 31-48

  • Nano- and Biotechniques for Electronic Device Packaging

    Gerlach, Gerald

    Pages 49-76

  • 3D Design

    Lienig, Jens

    Pages 79-96

  • 3D Data Structures for Nanoscale Design

    Fischbach, Robert

    Pages 97-118

Buy this book

eBook $119.00
price for USA (gross)
valid through November 5, 2017
  • ISBN 978-3-642-28522-6
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $159.00
price for USA
valid through November 5, 2017
  • ISBN 978-3-642-28521-9
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $159.00
price for USA
valid through November 5, 2017
  • ISBN 978-3-642-44286-5
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Bio and Nano Packaging Techniques for Electron Devices
Book Subtitle
Advances in Electronic Device Packaging
Editors
  • Gerald Gerlach
  • Klaus-Jürgen Wolter
Copyright
2012
Publisher
Springer-Verlag Berlin Heidelberg
Copyright Holder
Springer-Verlag Berlin Heidelberg
eBook ISBN
978-3-642-28522-6
DOI
10.1007/978-3-642-28522-6
Hardcover ISBN
978-3-642-28521-9
Softcover ISBN
978-3-642-44286-5
Edition Number
1
Number of Pages
XII, 628
Topics