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Scanning Tunneling Microscopy and Its Application

  • Book
  • © 2000

Overview

  • This volume is one of the few application-oriented STM books

Part of the book series: Springer Series in Surface Sciences (SSSUR, volume 32)

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Keywords

  • Nanobiology
  • Nanoscience
  • Nanospectroscopy
  • STM instrumentation
  • Scanning Force Microscopy
  • Scanning Probe Microscopy
  • Surface Chemistry
  • Surface Science
  • Tunneling Spectroscopy
  • Tunneling effect
  • electronic structure of surfaces
  • scanning probe microscopy
  • scanning tunneling microscopy
  • surface adsorption
  • surface structure

About this book

Scanning Tunneling Microscopy and its Application presents a unified view of the rapidly growing field of STM,and its many derivatives. A thorough discussion of the various principles provides the background to tunneling phenomena and leads to the many novel scanning-probe techniques, such as AFM, MFM, BEEM, PSTM, etc. After having examined the available instrumentation and the methods for tip and surface preparations, the monograph provides detailed accounts of STM application to metal and semiconductor surfaces, adsorbates and surface chemistry, biology, and nanofabrication. It examines limitations of the present-day investigations and provides hints about possible further trends. This second edition includes important new developments in the field.

Authors and Affiliations

  • Chinese Academy of Sciences Institute of Chemistry, Beijing, China

    Chunli Bai

Bibliographic Information

  • Book Title: Scanning Tunneling Microscopy and Its Application

  • Authors: Chunli Bai

  • Series Title: Springer Series in Surface Sciences

  • Publisher: Springer Berlin, Heidelberg

  • Copyright Information: Springer-Verlag Berlin Heidelberg 2000

  • Hardcover ISBN: 978-3-540-65715-6Published: 10 August 2000

  • Softcover ISBN: 978-3-642-08500-0Published: 01 December 2010

  • Series ISSN: 0931-5195

  • Series E-ISSN: 2198-4743

  • Edition Number: 2

  • Number of Pages: XIV, 370

  • Additional Information: Jointly published with Shanghai Scientific and Technical Publishers

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