Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication

From Particle Scale to Feature, Die and Wafer Scales

Authors: Luo, Jianfeng, Dornfeld, David

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eBook $189.00
price for USA (gross)
  • ISBN 978-3-662-07928-7
  • Digitally watermarked, DRM-free
  • Included format: PDF
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  • Immediate eBook download after purchase
Hardcover $239.00
price for USA
  • ISBN 978-3-540-22369-6
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $239.00
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  • ISBN 978-3-642-06115-8
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
About this book

This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. The important role of the mechanical elements of the process are included in such an "integrated model". The objective of the book is to introduce some background on the overlooked mechanical aspects of the process - including pad surface topography and abrasive particles. The "integrated model" can be particularly useful as one looks towards optimization of the process, design of consumables and, importantly, looking to minimize the environmental affects of CMP.

Table of contents (9 chapters)

  • Introduction

    Luo, Jianfeng (et al.)

    Pages 1-13

  • Review of CMP Modeling

    Luo, Jianfeng (et al.)

    Pages 15-52

  • Material Removal Mechanism in CMP: A Comprehensive Model of Abrasive Particle, Pad Asperity and Wafer Interactions

    Luo, Jianfeng (et al.)

    Pages 53-95

  • Effects of Abrasive Size Distribution in CMP

    Luo, Jianfeng (et al.)

    Pages 97-113

  • Material Removal Regions in CMP: Coupling Effects of Slurry Chemicals, Abrasive Particle Size Distribution and Wafer-Pad Contact Area

    Luo, Jianfeng (et al.)

    Pages 115-145

Buy this book

eBook $189.00
price for USA (gross)
  • ISBN 978-3-662-07928-7
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $239.00
price for USA
  • ISBN 978-3-540-22369-6
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $239.00
price for USA
  • ISBN 978-3-642-06115-8
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
Book Subtitle
From Particle Scale to Feature, Die and Wafer Scales
Authors
Copyright
2004
Publisher
Springer-Verlag Berlin Heidelberg
Copyright Holder
Springer-Verlag Berlin Heidelberg
eBook ISBN
978-3-662-07928-7
DOI
10.1007/978-3-662-07928-7
Hardcover ISBN
978-3-540-22369-6
Softcover ISBN
978-3-642-06115-8
Edition Number
1
Number of Pages
XXIV, 311
Topics