Microtechnology and MEMS

Force Sensors for Microelectronic Packaging Applications

Authors: Schwizer, Jürg, Mayer, Michael, Brand, Oliver

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About this book

This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

Buy this book

eBook n/a
  • ISBN 978-3-540-26945-8
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
Hardcover n/a
  • ISBN 978-3-540-22187-6
  • Free shipping for individuals worldwide
Softcover n/a
  • ISBN 978-3-642-06063-2
  • Free shipping for individuals worldwide
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Bibliographic Information

Bibliographic Information
Book Title
Force Sensors for Microelectronic Packaging Applications
Authors
Series Title
Microtechnology and MEMS
Copyright
2005
Publisher
Springer-Verlag Berlin Heidelberg
Copyright Holder
Springer-Verlag Berlin Heidelberg
eBook ISBN
978-3-540-26945-8
DOI
10.1007/b138345
Hardcover ISBN
978-3-540-22187-6
Softcover ISBN
978-3-642-06063-2
Series ISSN
1615-8326
Edition Number
1
Number of Pages
VIII, 178
Topics