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Epoxy Resins and Composites IV

  • Conference proceedings
  • © 1986

Overview

Editors:
  1. K. DuĊĦek
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Part of the book series: Advances in Polymer Science (POLYMER, volume 80)

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Table of contents (5 papers)

  1. Front Matter

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  2. Dielectric analysis of thermoset cure

    • Stephen D. Senturia, Norman F. Sheppard Jr.
    Pages 1-47

  3. Epoxy-aromatic amine networks in the glassy state structure and properties

    • Eduard F. Oleinik
    Pages 49-99

  4. Void growth and resin transport during processing of thermosetting — Matrix composites

    • J. L. Kardos, M. P. Duduković, R. Dave
    Pages 101-123

  5. Physical aging in epoxy matrices and composites

    • Eric Siu-Wai Kong
    Pages 125-171

  6. Curing mechanisms and mechanical properties of cured epoxy resins

    • Takashi Kamon, Hitoshi Furukawa
    Pages 173-202

  7. Back Matter

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Keywords

Bibliographic Information

  • Book Title: Epoxy Resins and Composites IV

  • Editors: K. DuĊĦek

  • Series Title: Advances in Polymer Science

  • DOI: https://doi.org/10.1007/3-540-16423-5

  • Publisher: Springer Berlin, Heidelberg

  • eBook Packages: Springer Book Archive

  • Copyright Information: Springer-Verlag Berlin Heidelberg 1986

  • Softcover ISBN: 978-3-662-15180-8Published: 17 April 2014

  • eBook ISBN: 978-3-540-39775-5Published: 17 September 2005

  • Series ISSN: 0065-3195

  • Series E-ISSN: 1436-5030

  • Edition Number: 1

  • Number of Pages: XIII, 220

  • Topics: Polymer Sciences

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