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Nanopackaging: From Nanomaterials to the Atomic Scale

Proceedings of the 1st International Workshop on Nanopackaging, Grenoble 27-28 June 2013

  • Conference proceedings
  • © 2015

Overview

Editors:
  1. Xavier Baillin

    1. CEA Grenoble, Grenoble, France

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  2. Christian Joachim

    1. CEMES-CNRS, University Paul Sabatier, Toulouse, France

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    You can also search for this editor in PubMed   Google Scholar

  3. Gilles Poupon

    1. CEA Grenoble, Grenoble, France

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  • Offers a multi-disciplinary approach to the packaging field
  • Discusses the latest developments in packaging specifications and technological developments in the study of atomic scale circuits and devices
  • Provides information for the use of CNT in order to improve classical packaging technology
  • Includes supplementary material: sn.pub/extras

Part of the book series: Advances in Atom and Single Molecule Machines (AASMM)

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Table of contents (11 papers)

  1. Front Matter

    Pages i-viii
    Download chapter PDF

  2. Utilization of Peridynamic Theory for Modeling at the Nano-Scale

    • E. Oterkus, C. Diyaroglu, N. Zhu, S. Oterkus, E. Madenci
    Pages 1-16

  3. DNA Metallization Processes and Nanoelectronics

    • Arianna Filoramo
    Pages 17-32

  4. Evaluation of Leakage Current in 1-D Silicon Dangling-Bond Wire Due to Dopants

    • R. Robles, M. Kepenekian, N. Lorente
    Pages 33-40

  5. Direct Integration of Carbon Nanotubes in Si Microsystems

    • Knut E. Aasmundtveit
    Pages 41-58

  6. Nanopackaging Requests for Atomic Scale Circuits and Molecule-Machines

    • Christian Joachim
    Pages 59-81

  7. Single-Crystal Au Triangles as Reconfigurable Contacts for Atomically Smooth Surfaces: Ultra-High Vacuum Transfer-Printing

    • Cedric Troadec, René Heimbuch, Deng Jie, Olga Neucheva, Ramesh Thamankar, Yap Tiong Leh et al.
    Pages 83-91

  8. Site-Selective Self-Assembly of Nano-Objects on a Planar Substrate Based on Surface Chemical Functionalization

    • Francisco Palazon, Pedro Rojo Romeo, Ali Belarouci, Céline Chevalier, Hassan Chamas, Éliane Souteyrand et al.
    Pages 93-112

  9. Silicon Technologies for Nanoscale Device Packaging

    • Aurélie Thuaire, Gaëlle Le Gac, Guillaume Audoit, François Aussenac, Caroline Rauer, Emmanuel Rolland et al.
    Pages 113-135

  10. Designing Carbon Nanotube Interconnects for Radio Frequency Applications

    • Christophe Brun, Chin Chong Yap, Dominique Baillargeat, Beng Kang Tay
    Pages 137-154

  11. Packaging of Buckyballs/Buckytubes in Transparent Photo-Active Inorganic Polymers: New Hope in the Area of Electronics and Optoelectronics

    • Radhaballabh Debnath
    Pages 155-173

  12. Novel Nanostructured Passives for RF and Power Applications: Nanopackaging with Passive Components

    • P. Markondeya Raj, Parthasarathi Chakraborti, Dibyajat Mishra, Himani Sharma, Saumya Gandhi, Srikrishna Sitaraman et al.
    Pages 175-189
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Keywords

About this book

This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community.

Editors and Affiliations

  • CEA Grenoble, Grenoble, France

    Xavier Baillin, Gilles Poupon

  • CEMES-CNRS, University Paul Sabatier, Toulouse, France

    Christian Joachim

About the editors

Xavier BAILLIN is CEA senior expert in the field of micro devices packaging. After twenty years dedicated to address basic research focused on the relationship between microstructure and mechanical behavior of different industrial alloys, he joined Léti in 2003 where he has been in charge of wafer level packaging activity. He has specially contributed to the development of technologies dedicated to atmosphere controlled packaging for MEMS and also in 3D integration technologies. Xavier is the co-author of about 40 publications and 20 patents. He is currently involved in a flagship project launched by CEA in 2013 and focused on bio-inspired solutions development for 3D construction at the nanometric scale.

Gilles Poupon (IEEE M’05, SM’10) received his M.S. in Electrochemistry in 1985. He joined CEA-LETI, Grenoble, France, in 1987 where he has been Director of Strategic Programs on Advanced Packaging for 10 years and is now Scientific Advisor. Gilles Poupon is a member of the Board of Governors of the IEEE Components Packaging and Manufacturing Technology Society (CPMT) and Technical Director of the International Microelectronics and Packaging Society France (IMAPS). Additionally, Gilles is Scientific Advisor of EURIPIDES (European cluster on packaging) and member of ITRS Assembly & Packaging Technical Working Group and European Branch of JISSO working group. Gilles Poupon has published two books and he has authored 3 chapters of books and co-authored and authored over 50 proceedings papers and journal papers. He has more than 10 patents in the field of advanced packaging, micro systems technologies and 3D integration.

Christian JOACHIM is CNRS Director of Research, Nanosciences group at CEMES/CNRS and adjunct Professor of Quantum Physics at Sup’Aero (ISAE) Toulouse. In Singapore, he is A*STAR VIP at IMRE on atom technology and head of the WPI MANA-NIMS satellite in Toulouse. He coordinated European projects like "Bottom-upNanomachines" and “Pico-Inside”. He is currently coordinating the large European integrated project AtMol (2011-2014) to build the first ever molecular chip. He is the author of more than 230 scientific publications (h=51) and has presented over 310 invited talks on electron transfer through a molecule, STM and Atomic Force Microscopy (AFM) image calculations, tunnel transport through a molecule, molecular devices, nanolithography and single molecule machines. His book: “Nanosciences, the invisible revolution” (World Scientific, 2009) is presenting the history of Nanosciences and its political drawbacks to a general public.

Bibliographic Information

  • Book Title: Nanopackaging: From Nanomaterials to the Atomic Scale

  • Book Subtitle: Proceedings of the 1st International Workshop on Nanopackaging, Grenoble 27-28 June 2013

  • Editors: Xavier Baillin, Christian Joachim, Gilles Poupon

  • Series Title: Advances in Atom and Single Molecule Machines

  • DOI: https://doi.org/10.1007/978-3-319-21194-7

  • Publisher: Springer Cham

  • eBook Packages: Chemistry and Materials Science, Chemistry and Material Science (R0)

  • Copyright Information: Springer International Publishing Switzerland 2015

  • Hardcover ISBN: 978-3-319-21193-0Published: 19 August 2015

  • Softcover ISBN: 978-3-319-35650-1Published: 22 October 2016

  • eBook ISBN: 978-3-319-21194-7Published: 06 August 2015

  • Series ISSN: 2193-9691

  • Series E-ISSN: 2193-9705

  • Edition Number: 1

  • Number of Pages: VIII, 189

  • Number of Illustrations: 77 b/w illustrations, 47 illustrations in colour

  • Topics: Nanochemistry, Nanotechnology, Biological and Medical Physics, Biophysics

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