Analog Circuits and Signal Processing

Arbitrary Modeling of TSVs for 3D Integrated Circuits

Authors: Salah, Khaled, Ismail, Yehea, El-Rouby, Alaa

  • Introduces a robust model that captures accurately all the loss modes of a TSV, coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region
  • Enables readers to use a model which is technology dependent and can be used for any TSV configuration
  • Reveals a novel on-chip wireless communication technique, based on TSV spiral inductors
  • Equips readers for fast parasitic extraction of TSVs for 3D IC design
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eBook $99.00
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  • ISBN 978-3-319-07611-9
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  • Immediate eBook download after purchase
Hardcover $129.00
price for USA
  • ISBN 978-3-319-07610-2
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  • Usually dispatched within 3 to 5 business days.
Softcover $129.00
price for USA
  • ISBN 978-3-319-37497-0
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Rent the ebook  
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About this book

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

Table of contents (10 chapters)

  • Introduction: Work Around Moore’s Law

    Salah, Khaled (et al.)

    Pages 1-15

  • 3D/TSV-Enabling Technologies

    Salah, Khaled (et al.)

    Pages 17-47

  • TSV Modeling and Analysis

    Salah, Khaled (et al.)

    Pages 49-83

  • TSV Verification

    Salah, Khaled (et al.)

    Pages 85-94

  • TSV Macro-Modeling Framework

    Salah, Khaled (et al.)

    Pages 95-101

Buy this book

eBook $99.00
price for USA (gross)
  • ISBN 978-3-319-07611-9
  • Digitally watermarked, DRM-free
  • Included format: PDF, EPUB
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $129.00
price for USA
  • ISBN 978-3-319-07610-2
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $129.00
price for USA
  • ISBN 978-3-319-37497-0
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Rent the ebook  
  • Rental duration: 1 or 6 month
  • low-cost access
  • online reader with highlighting and note-making option
  • can be used across all devices
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Bibliographic Information

Bibliographic Information
Book Title
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Authors
Series Title
Analog Circuits and Signal Processing
Copyright
2015
Publisher
Springer International Publishing
Copyright Holder
Springer International Publishing Switzerland
eBook ISBN
978-3-319-07611-9
DOI
10.1007/978-3-319-07611-9
Hardcover ISBN
978-3-319-07610-2
Softcover ISBN
978-3-319-37497-0
Series ISSN
1872-082X
Edition Number
1
Number of Pages
IX, 179
Number of Illustrations and Tables
60 b/w illustrations, 99 illustrations in colour
Topics