Solder Joint Reliability Assessment

1. Front Matter

   Pages i-xiii

   PDF

2. Introduction

   • Mohd N. Tamin, Mohd N. Tamin

   Pages 1-6

3. Overview of the Simulation Methodology

   • Mohd N. Tamin, Norhashimah M. Shaffiar

   Pages 7-21

4. Essentials for Finite Element Simulation

   • Mohd N. Tamin, Norhashimah M. Shaffiar

   Pages 23-43

5. Mechanics of Solder Materials

   • Mohd N. Tamin, Norhashimah M. Shaffiar

   Pages 45-73

6. Application I: Solder Joint Reflow Process

   • Mohd N. Tamin, Norhashimah M. Shaffiar

   Pages 75-85

7. Application II: Solder Joints Under Temperature and Mechanical Load Cycles

   • Mohd N. Tamin, Norhashimah M. Shaffiar

   Pages 87-116

8. Damage Mechanics-Based Models

   • Mohd N. Tamin, Norhashimah M. Shaffiar

   Pages 117-136

9. Application III: Board-Level Drop Test

   • Mohd N. Tamin, Norhashimah M. Shaffiar

   Pages 137-151

10. Application IV: Fatigue Fracture Process of Solder Joints

    • Mohd N. Tamin, Norhashimah M. Shaffiar

    Pages 153-171

11. Back Matter

    Pages 173-174

    PDF

This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.

• Ball Grid Array BGA
• Cohesive Zone Model
• Continuum Damage Model
• Damage Mechanics
• Fatigue Life Prediction
• Numerical Experiment Framework
• Temperature Cycles
• Unified Inelastic Strain Model
• quality control, reliability, safety and risk

• Faculty of Mechanical Engineering, Universiti Teknologi Malaysia, 81310 UTM Skudai, Johor Bahru, Malaysia

  Mohd N. Tamin

• Department of Manufacturing and Materials, Kulliyyah of Engineering, International Islamic University Malaysia, 53100 Gombak, Kuala Lumpur, Malaysia

  Norhashimah M. Shaffiar

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