Advanced Structured Materials

Solder Joint Reliability Assessment

Finite Element Simulation Methodology

Authors: Tamin, Mohd N., Shaffiar, Norhashimah M.

  • Presents a systematic approach in performing reliability assessment
  • Emphazises accurate quantitative assessment through basic understanding of the mechanics of materials
  • The presented simulation methodology is readily applicable to numerous problems
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Buy this book

eBook $139.00
price for USA (gross)
  • ISBN 978-3-319-00092-3
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $179.00
price for USA
  • ISBN 978-3-319-00091-6
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $179.00
price for USA
  • Customers within the U.S. and Canada please contact Customer Service at 1-800-777-4643, Latin America please contact us at +1-212-460-1500 (Weekdays 8:30am – 5:30pm ET) to place your order.
  • Due: October 21, 2016
  • ISBN 978-3-319-34301-3
  • Free shipping for individuals worldwide
About this book

This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.

Table of contents (9 chapters)

  • Introduction

    Tamin, Mohd N. (et al.)

    Pages 1-6

  • Overview of the Simulation Methodology

    Tamin, Mohd N. (et al.)

    Pages 7-21

  • Essentials for Finite Element Simulation

    Tamin, Mohd N. (et al.)

    Pages 23-43

  • Mechanics of Solder Materials

    Tamin, Mohd N. (et al.)

    Pages 45-73

  • Application I: Solder Joint Reflow Process

    Tamin, Mohd N. (et al.)

    Pages 75-85

Buy this book

eBook $139.00
price for USA (gross)
  • ISBN 978-3-319-00092-3
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $179.00
price for USA
  • ISBN 978-3-319-00091-6
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $179.00
price for USA
  • Customers within the U.S. and Canada please contact Customer Service at 1-800-777-4643, Latin America please contact us at +1-212-460-1500 (Weekdays 8:30am – 5:30pm ET) to place your order.
  • Due: October 21, 2016
  • ISBN 978-3-319-34301-3
  • Free shipping for individuals worldwide
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Bibliographic Information

Bibliographic Information
Book Title
Solder Joint Reliability Assessment
Book Subtitle
Finite Element Simulation Methodology
Authors
Series Title
Advanced Structured Materials
Series Volume
37
Copyright
2014
Publisher
Springer International Publishing
Copyright Holder
Springer International Publishing Switzerland
eBook ISBN
978-3-319-00092-3
DOI
10.1007/978-3-319-00092-3
Hardcover ISBN
978-3-319-00091-6
Softcover ISBN
978-3-319-34301-3
Series ISSN
1869-8433
Edition Number
1
Number of Pages
XIII, 174
Number of Illustrations and Tables
64 b/w illustrations, 55 illustrations in colour
Topics