Fundamentals of Lead-Free Solder Interconnect Technology

From Microstructures to Reliability

Authors: Lee, T.-K., Bieler, Th.R., Kim, C.-U., Ma, H.

  • Provides an up-to-date overview on lead-free soldering technologies
  • Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering techniques
  • Explores emerging technologies in lead-free soldering
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Buy this book

eBook $99.00
price for USA (gross)
  • ISBN 978-1-4614-9266-5
  • Digitally watermarked, DRM-free
  • Included format: PDF, EPUB
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $129.00
price for USA
  • ISBN 978-1-4614-9265-8
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $129.00
price for USA
  • ISBN 978-1-4899-7801-1
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
About this book

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

Reviews

From the book reviews:

“The book gives wide perspectives on the technical insights of lead-free solder interconnect system and reliability prediction in industry while adding very valuable industry insights. It is a good resource to demonstrate the many facets of lead-free solder interconnection, and can serve as a very informative technical reference. Valuable as a learning tool for fundamentals of lead-free solder interconnect technology, its clear relevance to real world industry practices make it useful for both academics and semiconductor industry practitioners.” (Chong Leong Gan and Uda Hashim, Microelectronics Reliability, February, 2015)


Table of contents (8 chapters)

  • Introduction

    Lee, Tae-Kyu (et al.)

    Pages 1-20

  • Interconnection: The Joint

    Lee, Tae-Kyu (et al.)

    Pages 21-50

  • Phase Equilibria and Microstructure of Sn–Ag–Cu Alloys

    Lee, Tae-Kyu (et al.)

    Pages 51-80

  • Microstructure Development: Solidification and Isothermal Aging

    Lee, Tae-Kyu (et al.)

    Pages 81-112

  • Thermal Cycling Performance

    Lee, Tae-Kyu (et al.)

    Pages 113-168

Buy this book

eBook $99.00
price for USA (gross)
  • ISBN 978-1-4614-9266-5
  • Digitally watermarked, DRM-free
  • Included format: PDF, EPUB
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $129.00
price for USA
  • ISBN 978-1-4614-9265-8
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $129.00
price for USA
  • ISBN 978-1-4899-7801-1
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Fundamentals of Lead-Free Solder Interconnect Technology
Book Subtitle
From Microstructures to Reliability
Authors
Copyright
2015
Publisher
Springer US
Copyright Holder
Springer Science+Business Media New York
eBook ISBN
978-1-4614-9266-5
DOI
10.1007/978-1-4614-9266-5
Hardcover ISBN
978-1-4614-9265-8
Softcover ISBN
978-1-4899-7801-1
Edition Number
1
Number of Pages
XIII, 253
Number of Illustrations and Tables
70 b/w illustrations, 81 illustrations in colour
Topics