Micro- and Opto-Electronic Materials, Structures, and Systems

Packaging of High Power Semiconductor Lasers

Authors: Liu, X., Zhao, W., Xiong, L., Liu, H.

  • Describes packaging design for high power semiconductor lasers
  • Details prevention techniques for thermal stress failures
  • Discusses most recent technology trends in semiconductor laser packaging
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eBook $139.00
price for USA (gross)
  • ISBN 978-1-4614-9263-4
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $179.00
price for USA
  • ISBN 978-1-4614-9262-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $179.00
price for USA
  • ISBN 978-1-4939-5590-9
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Rent the ebook  
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About this book

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

About the authors

Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.

Table of contents (11 chapters)

  • Introduction of High Power Semiconductor Lasers

    Liu, Xingsheng (et al.)

    Pages 1-28

  • Overview of High Power Semiconductor Laser Packages

    Liu, Xingsheng (et al.)

    Pages 29-52

  • Thermal Design and Management in High Power Semiconductor Laser Packaging

    Liu, Xingsheng (et al.)

    Pages 53-88

  • Thermal Stress in High Power Semiconductor Lasers

    Liu, Xingsheng (et al.)

    Pages 89-105

  • Optical Design and Beam Shaping in High Power Semiconductor Lasers

    Liu, Xingsheng (et al.)

    Pages 107-154

Buy this book

eBook $139.00
price for USA (gross)
  • ISBN 978-1-4614-9263-4
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $179.00
price for USA
  • ISBN 978-1-4614-9262-7
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $179.00
price for USA
  • ISBN 978-1-4939-5590-9
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Rent the ebook  
  • Rental duration: 1 or 6 month
  • low-cost access
  • online reader with highlighting and note-making option
  • can be used across all devices
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Bibliographic Information

Bibliographic Information
Book Title
Packaging of High Power Semiconductor Lasers
Authors
Series Title
Micro- and Opto-Electronic Materials, Structures, and Systems
Copyright
2015
Publisher
Springer-Verlag New York
Copyright Holder
Springer Science+Business Media New York
eBook ISBN
978-1-4614-9263-4
DOI
10.1007/978-1-4614-9263-4
Hardcover ISBN
978-1-4614-9262-7
Softcover ISBN
978-1-4939-5590-9
Edition Number
1
Number of Pages
XV, 402
Number of Illustrations and Tables
111 b/w illustrations, 386 illustrations in colour
Topics