Nanostructure Science and Technology

Copper Electrodeposition for Nanofabrication of Electronics Devices

Editors: Kondo, K., Akolkar, R.N., Barkey, D.P., Yokoi, M. (Eds.)

  • Focuses on wide range of microelectronics application
  • Describes scientific mechanism of copper electrodeposition
  • Modern and basic knowledge about nanotechnology
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eBook $99.00
price for USA (gross)
  • ISBN 978-1-4614-9176-7
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $129.00
price for USA
  • ISBN 978-1-4614-9175-0
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $129.00
price for USA
  • ISBN 978-1-4939-5373-8
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
About this book

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.

About the authors

Kazuo Kondo is Professor at the Department of Chemical engineering, Osaka Prefecture University. He has over 200 research publications and 100 patents. His major areas of research are copper electrodeposition for nano fabrication, electrodeposition, batteries, and CVD.

Dale Barkey is a Professor of Chemical Engineering at the University of New Hampshire where he joined the faculty in 1987. His research in Electrochemical Engineering has addressed Pattern Formation, Electrodeposition, Anodizing and Corrosion Processes. His work has appeared in The Journal of the Electrochemical Society, Physical Review, The American Concrete Institute Materials Journal and Plating and Surface Finishing.

Rohan Akolkar is an Associate Professor of Chemical Engineering at Case Western Reserve University (CWRU) in Cleveland, OH. His research focuses on fundamental electrochemistry and electrochemical engineering. His work on electrodeposition has appeared in the Journal of the Electrochemical Society and the Journal of Power Sources. In 2004, he was received the Norman Hackerman Prize by the Electrochemical Society.

Masayuki Yokoi is the Chief Technical Consultant at the Industrial Technology Support Institute of Higashioska City, Osaka Prefecture, Japan.

Table of contents (12 chapters)

  • Copper Electrodepositon

    Yokoi, Masayuki

    Pages 3-25

  • Supression Effect and Additive Chemistry

    Yokoi, Masayuki

    Pages 27-43

  • Acceleration Effect

    Barkey, Dale P.

    Pages 45-61

  • Modeling and Simulation

    Kaneko, Yutaka

    Pages 63-95

  • Frontiers of Cu Electrodeposition and Electroless Plating for On-chip Interconnects

    Rohan, James F. (et al.)

    Pages 99-113

Buy this book

eBook $99.00
price for USA (gross)
  • ISBN 978-1-4614-9176-7
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $129.00
price for USA
  • ISBN 978-1-4614-9175-0
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $129.00
price for USA
  • ISBN 978-1-4939-5373-8
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Copper Electrodeposition for Nanofabrication of Electronics Devices
Editors
  • Kazuo Kondo
  • Rohan N. Akolkar
  • Dale P. Barkey
  • Masayuki Yokoi
Series Title
Nanostructure Science and Technology
Copyright
2014
Publisher
Springer-Verlag New York
Copyright Holder
Springer Science+Business Media New York
eBook ISBN
978-1-4614-9176-7
DOI
10.1007/978-1-4614-9176-7
Hardcover ISBN
978-1-4614-9175-0
Softcover ISBN
978-1-4939-5373-8
Series ISSN
1571-5744
Edition Number
1
Number of Pages
VIII, 282
Number of Illustrations and Tables
115 b/w illustrations, 75 illustrations in colour
Topics