Advanced Thermal Management Materials

Authors: Jiang, Guosheng, Diao, Liyong, Kuang, Ken

  • Provides an in-depth overview of copper, metal and aluminum materials and discusses the advantages and disadvantages of each in thermal management
  • Discusses numerical simulation methods and techniques used in analysis of electronic devices and materials
  • Covers system and component integration of advanced packaging materials
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eBook $109.00
price for USA (gross)
  • ISBN 978-1-4614-1963-1
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $149.99
price for USA
  • ISBN 978-1-4614-1962-4
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $119.99
price for USA
  • ISBN 978-1-4899-9254-3
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
About this book

Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.

Table of contents (10 chapters)

  • Introduction to Thermal Management in Microelectronics Packaging

    Jiang, Guosheng (et al.)

    Pages 1-10

  • Requirements of Thermal Management Materials

    Jiang, Guosheng (et al.)

    Pages 11-28

  • Overview of Traditional Thermal Management Materials

    Jiang, Guosheng (et al.)

    Pages 29-44

  • Development of Advanced Thermal Management Materials

    Jiang, Guosheng (et al.)

    Pages 45-71

  • Properties of WCu, MoCu, and Cu/MoCu/Cu High-performance Heat Sink Materials and Manufacturing Technologies

    Jiang, Guosheng (et al.)

    Pages 73-87

Buy this book

eBook $109.00
price for USA (gross)
  • ISBN 978-1-4614-1963-1
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $149.99
price for USA
  • ISBN 978-1-4614-1962-4
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $119.99
price for USA
  • ISBN 978-1-4899-9254-3
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Advanced Thermal Management Materials
Authors
Copyright
2013
Publisher
Springer-Verlag New York
Copyright Holder
Springer Science+Business Media New York
eBook ISBN
978-1-4614-1963-1
DOI
10.1007/978-1-4614-1963-1
Hardcover ISBN
978-1-4614-1962-4
Softcover ISBN
978-1-4899-9254-3
Edition Number
1
Number of Pages
XII, 156
Topics