Design for Manufacturability

From 1D to 4D for 90–22 nm Technology Nodes

Authors: Balasinski, Artur

  • Provides design for manufacturability guidelines on layout techniques for the most advanced, 22 nm  technology nodes
  • Includes information valuable to layout designers, packaging engineers and quality engineers, working on memories, logic, system-on-chip and system-in-package
  • Offers a highly-accessible, single-source reference to information otherwise available only from disparate sources
  • Helps readers to translate reliability methodology into real design flows
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eBook $89.00
price for USA (gross)
  • ISBN 978-1-4614-1761-3
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $139.99
price for USA
  • ISBN 978-1-4614-1760-6
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $119.99
price for USA
  • ISBN 978-1-4939-4342-5
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Rent the eBook  
  • Rental duration: 1 or 6 month
  • low-cost access
  • online reader with highlighting and note-making option
  • can be used across all devices
About this book

This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes.  It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.

About the authors

Artur Balasinski is a Technology Design Integration Manager for Cypress Semiconductor in San Jose, California.

Table of contents (5 chapters)

Buy this book

eBook $89.00
price for USA (gross)
  • ISBN 978-1-4614-1761-3
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $139.99
price for USA
  • ISBN 978-1-4614-1760-6
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $119.99
price for USA
  • ISBN 978-1-4939-4342-5
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Rent the eBook  
  • Rental duration: 1 or 6 month
  • low-cost access
  • online reader with highlighting and note-making option
  • can be used across all devices
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Bibliographic Information

Bibliographic Information
Book Title
Design for Manufacturability
Book Subtitle
From 1D to 4D for 90–22 nm Technology Nodes
Authors
Copyright
2014
Publisher
Springer-Verlag New York
Copyright Holder
Springer Science+Business Media New York
Distribution Rights
Distribution rights for India: Delhi Book Store, New Delhi, India
eBook ISBN
978-1-4614-1761-3
DOI
10.1007/978-1-4614-1761-3
Hardcover ISBN
978-1-4614-1760-6
Softcover ISBN
978-1-4939-4342-5
Edition Number
1
Number of Pages
VIII, 278
Number of Illustrations and Tables
169 b/w illustrations, 45 illustrations in colour
Topics