Molecular Modeling and Multiscaling Issues for Electronic Material Applications

Editors: Iwamoto, Nancy, Yuen, Matthew, Fan, Haibo (Eds.)

  • Discusses multiscale modeling of materials at the mesoscale
  • Covers atomistic modeling of mechanical properties
  • Provides practical examples for engineers interested in molecular modeling using simulations drawn from electronic packaging, dielectric materials, and thermal and mechanical properties
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About this book

Molecular Modeling and Multiscaling Issues for Electronic Material Applications provides a snapshot on the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand material performance to solve relevant issues in this field. This book is intended to introduce the reader to the evolving role of molecular modeling, especially seen through the eyes of the IEEE community involved in material modeling for electronic applications.  Part I presents  the role that quantum mechanics can play in performance prediction, such as properties dependent upon electronic structure, but also shows examples how molecular models may be used in performance diagnostics, especially when chemistry is part of the performance issue.  Part II gives examples of large-scale atomistic methods in material failure and shows several examples of transitioning between grain boundary simulations (on the atomistic level)and large-scale models including an example of the use of quasi-continuum methods that are being used to address multiscaling issues.   Part III is a more specific look at molecular dynamics in the determination of the thermal conductivity of carbon-nanotubes.   Part IV covers the many aspects of molecular modeling needed to understand the relationship between the molecular structure and mechanical performance of materials.   Finally, Part V discusses the transitional topic of multiscale modeling and recent developments to reach the submicronscale using mesoscale models, including examples of direct scaling and parameterization from the atomistic to the coarse-grained particle level.

Table of contents (14 chapters)

  • Atomistic Simulations of Microelectronic Materials: Prediction of Mechanical, Thermal, and Electrical Properties

    Eyert, V. (et al.)

    Pages 3-24

  • Using Molecular Modeling Trending to Understand Dielectric Susceptibility in Dielectrics for Display Applications

    Iwamoto, Nancy (et al.)

    Pages 25-37

  • Understanding Cleaner Efficiency for BARC (“Bottom Anti-Reflective Coating”) After Plasma Etch in Dual Damascene Structures Through the Practical Use of Molecular Modeling Trends

    Iwamoto, Nancy (et al.)

    Pages 39-52

  • Roles of Grain Boundaries in the Strength of Metals by Using Atomic Simulations

    Shimokawa, Tomotsugu

    Pages 55-75

  • Semi Emprical Low Cycle Fatigue Crack Growth Analysis of Nanostructure Chip-To-Package Copper Interconnect Using Molecular Simulation

    Koh, S. (et al.)

    Pages 77-90

Buy this book

eBook $109.00
price for USA (gross)
  • ISBN 978-1-4614-1728-6
  • Digitally watermarked, DRM-free
  • Included format: PDF, EPUB
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $149.00
price for USA
  • ISBN 978-1-4614-1727-9
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $149.00
price for USA
  • ISBN 978-1-4899-8837-9
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Rent the ebook  
  • Rental duration: 1 or 6 month
  • low-cost access
  • online reader with highlighting and note-making option
  • can be used across all devices
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Bibliographic Information

Bibliographic Information
Book Title
Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Editors
  • Nancy Iwamoto
  • Matthew Yuen
  • Haibo Fan
Copyright
2012
Publisher
Springer-Verlag New York
Copyright Holder
Springer Science+Business Media, LLC
eBook ISBN
978-1-4614-1728-6
DOI
10.1007/978-1-4614-1728-6
Hardcover ISBN
978-1-4614-1727-9
Softcover ISBN
978-1-4899-8837-9
Edition Number
1
Number of Pages
XII, 260
Topics