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Power Electronic Packaging

Design, Assembly Process, Reliability and Modeling

Authors: Liu, Yong

  • Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSP
  • Provides the reader with a fundamental understanding of the evolution of power packaging, while also predicting future development trends in monolithic and hybrid integrations
  • Presents the most advanced simulation and modeling methodologies in electronic packaging design, reliability, and assembly to insure that practicioners can fully test their power electronic packaging designs
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eBook $199.00
price for USA (gross)
  • ISBN 978-1-4614-1053-9
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $259.00
price for USA
  • ISBN 978-1-4614-1052-2
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $259.00
price for USA
  • ISBN 978-1-4899-8797-6
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Rent the ebook  
  • Rental duration: 1 or 6 month
  • low-cost access
  • online reader with highlighting and note-making option
  • can be used across all devices
About this book

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Table of contents (12 chapters)

  • Challenges of Power Electronic Packaging

    Liu, Yong

    Pages 1-8

  • Power Package Electrical Isolation Design

    Liu, Yong

    Pages 9-26

  • Discrete Power MOSFET Package Design and Analysis

    Liu, Yong

    Pages 27-56

  • Power IC Package Design and Analysis

    Liu, Yong

    Pages 57-88

  • Power Module/SiP/3D/Stack/Embedded Packaging Design and Considerations

    Liu, Yong

    Pages 89-166

Buy this book

eBook $199.00
price for USA (gross)
  • ISBN 978-1-4614-1053-9
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $259.00
price for USA
  • ISBN 978-1-4614-1052-2
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $259.00
price for USA
  • ISBN 978-1-4899-8797-6
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Rent the ebook  
  • Rental duration: 1 or 6 month
  • low-cost access
  • online reader with highlighting and note-making option
  • can be used across all devices
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Bibliographic Information

Bibliographic Information
Book Title
Power Electronic Packaging
Book Subtitle
Design, Assembly Process, Reliability and Modeling
Authors
Copyright
2012
Publisher
Springer-Verlag New York
Copyright Holder
Springer Science+Business Media, LLC
eBook ISBN
978-1-4614-1053-9
DOI
10.1007/978-1-4614-1053-9
Hardcover ISBN
978-1-4614-1052-2
Softcover ISBN
978-1-4899-8797-6
Edition Number
1
Number of Pages
XVIII, 594
Topics