Lead Free Solder

Mechanics and Reliability

Authors: Pang, John Hock Lye

  • Discusses lead-free solder materials industry their selection and how they are currently used industry wide
  • Focuses on mechanics of materials theory in elastic, plastic, creep, fatigue and fracture assessments
  • Presents materials testing and characterization at the macro, micro, and nano scale
  • Details how to use reliability test and analysis for thermal cycling, cyclic bending and drop impact
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eBook $109.00
price for USA (gross)
  • ISBN 978-1-4614-0463-7
  • Digitally watermarked, DRM-free
  • Included format: PDF, EPUB
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $149.00
price for USA
  • ISBN 978-1-4614-0462-0
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $149.00
price for USA
  • ISBN 978-1-4899-9116-4
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Rent the ebook  
  • Rental duration: 1 or 6 month
  • low-cost access
  • online reader with highlighting and note-making option
  • can be used across all devices
About this book

Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.

Table of contents (8 chapters)

  • Introduction

    Pang, John Hock Lye

    Pages 1-5

  • Theory on Mechanics of Solder Materials

    Pang, John Hock Lye

    Pages 7-22

  • Mechanical Properties and Constitutive Models

    Pang, John Hock Lye

    Pages 23-48

  • Fatigue Life Prediction Models

    Pang, John Hock Lye

    Pages 49-63

  • Finite Element Analysis and Design-for-Reliability

    Pang, John Hock Lye

    Pages 65-88

Buy this book

eBook $109.00
price for USA (gross)
  • ISBN 978-1-4614-0463-7
  • Digitally watermarked, DRM-free
  • Included format: PDF, EPUB
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $149.00
price for USA
  • ISBN 978-1-4614-0462-0
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $149.00
price for USA
  • ISBN 978-1-4899-9116-4
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Rent the ebook  
  • Rental duration: 1 or 6 month
  • low-cost access
  • online reader with highlighting and note-making option
  • can be used across all devices
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Bibliographic Information

Bibliographic Information
Book Title
Lead Free Solder
Book Subtitle
Mechanics and Reliability
Authors
Copyright
2012
Publisher
Springer-Verlag New York
Copyright Holder
Springer Science+Business Media, LLC
eBook ISBN
978-1-4614-0463-7
DOI
10.1007/978-1-4614-0463-7
Hardcover ISBN
978-1-4614-0462-0
Softcover ISBN
978-1-4899-9116-4
Edition Number
1
Number of Pages
X, 175
Topics