Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

Authors: Lim, Sung Kyu

  • Describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs
  • Features sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs
  • Provides full details of all key algorithms, for maximum understanding and utility
  • Includes design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process
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eBook $109.00
price for USA (gross)
  • ISBN 978-1-4419-9542-1
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $139.00
price for USA
  • ISBN 978-1-4419-9541-4
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $139.00
price for USA
  • ISBN 978-1-4899-8696-2
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
About this book

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.

Table of contents (20 chapters)

Buy this book

eBook $109.00
price for USA (gross)
  • ISBN 978-1-4419-9542-1
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $139.00
price for USA
  • ISBN 978-1-4419-9541-4
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $139.00
price for USA
  • ISBN 978-1-4899-8696-2
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Authors
Copyright
2013
Publisher
Springer-Verlag New York
Copyright Holder
Springer Science+Business Media New York
eBook ISBN
978-1-4419-9542-1
DOI
10.1007/978-1-4419-9542-1
Hardcover ISBN
978-1-4419-9541-4
Softcover ISBN
978-1-4899-8696-2
Edition Number
1
Number of Pages
XXVIII, 560
Topics