Integrated Circuits and Systems

3D Integration for NoC-based SoC Architectures

Editors: Sheibanyrad, Abbas, Pétrot, Frédéric, Jantsch, Axel (Eds.)

  • Provides a detailed overview of the state of error control methods for on-chip interconnects, including Error Control Coding, Double Sampling, and On-Line Testing Describes the use of more complex concatenated codes such as Hamming Product Codes with Type-II HARQ, while emphasizing integration techniques for on-chip interconnect links Presents techniques for managing intermittent and permanent errors using a non-interrupting in-line test method with spare wire replacement

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About this book

Back Cover Copy SERIES: Integrated Circuits and Systems 3D-Integration for NoC-based SoC Architectures by: (Editors) Abbas Sheibanyrad Frédéric Petrot Axel Janstch This book investigates on the promises, challenges, and solutions for the 3D Integration (vertically stacking) of embedded systems connected via a network on a chip. It covers the entire architectural design approach for 3D-SoCs. 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures have emerged as topics critical for current R&D leading to a broad range of products. This book presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures. •Presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures; •Covers the entire architectural design approach for 3D-SoCs; •Includes state-of-the-art treatment of 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures.

Table of contents (11 chapters)

  • Three-Dimensional Integration of Integrated Circuits—an Introduction

    Tan, Chuan Seng

    Pages 3-26

  • The Promises and Limitations of 3-D Integration

    Jantsch, Axel (et al.)

    Pages 27-44

  • Testing 3D Stacked ICs Containing Through-Silicon Vias

    Marinissen, Erik Jan

    Pages 47-74

  • Design and Computer Aided Design of 3DIC

    Franzon, Paul D. (et al.)

    Pages 75-88

  • Physical Analysis of NoC Topologies for 3-D Integrated Systems

    Pavlidis, Vasilis F. (et al.)

    Pages 89-114

Buy this book

eBook $139.00
price for USA (gross)
  • ISBN 978-1-4419-7618-5
  • Digitally watermarked, DRM-free
  • Included format: PDF, EPUB
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $179.00
price for USA
  • ISBN 978-1-4419-7617-8
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $179.00
price for USA
  • ISBN 978-1-4614-2748-3
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Rent the ebook  
  • Rental duration: 1 or 6 month
  • low-cost access
  • online reader with highlighting and note-making option
  • can be used across all devices
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Bibliographic Information

Bibliographic Information
Book Title
3D Integration for NoC-based SoC Architectures
Editors
  • Abbas Sheibanyrad
  • Frédéric Pétrot
  • Axel Jantsch
Series Title
Integrated Circuits and Systems
Copyright
2011
Publisher
Springer-Verlag New York
Copyright Holder
Springer Science+Business Media, LLC
eBook ISBN
978-1-4419-7618-5
DOI
10.1007/978-1-4419-7618-5
Hardcover ISBN
978-1-4419-7617-8
Softcover ISBN
978-1-4614-2748-3
Series ISSN
1558-9412
Edition Number
1
Number of Pages
X, 278
Topics