Advanced Flip Chip Packaging

Editors: Ho-Ming, Tong, Lai, Yi-Shao, Wong, C.P. (Eds.)

  • Offers broad-ranging chapters with a focus on IC-package-system integration
  • Provides viewpoints from leading industry executives and experts
  • Details state-of-the-art achievements in process technologies and scientific research
  • Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information
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eBook $159.00
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  • ISBN 978-1-4419-5768-9
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  • Immediate eBook download after purchase
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price for USA
  • ISBN 978-1-4419-5767-2
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About this book

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

Table of contents (11 chapters)

  • Market Trends: Past, Present, and Future

    Lanzone, Robert

    Pages 1-21

  • Technology Trends: Past, Present, and Future

    Perfecto, Eric (et al.)

    Pages 23-52

  • Bumping Technologies

    Töpper, Michael (et al.)

    Pages 53-84

  • Flip-Chip Interconnections: Past, Present, and Future

    Kang, Sung-Kwon (et al.)

    Pages 85-154

  • Flip Chip Underfill: Materials, Process, and Reliability

    Zhang, Zhuqing (et al.)

    Pages 155-199

Buy this book

eBook $159.00
price for USA (gross)
  • ISBN 978-1-4419-5768-9
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $209.00
price for USA
  • ISBN 978-1-4419-5767-2
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Rent the ebook  
  • Rental duration: 1 or 6 month
  • low-cost access
  • online reader with highlighting and note-making option
  • can be used across all devices
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Bibliographic Information

Bibliographic Information
Book Title
Advanced Flip Chip Packaging
Editors
  • Tong Ho-Ming
  • Yi-Shao Lai
  • C.P. Wong
Copyright
2013
Publisher
Springer US
Copyright Holder
Springer Science+Business Media New York
eBook ISBN
978-1-4419-5768-9
DOI
10.1007/978-1-4419-5768-9
Hardcover ISBN
978-1-4419-5767-2
Edition Number
1
Number of Pages
VII, 560
Topics