Three Dimensional System Integration

IC Stacking Process and Design

Editors: Papanikolaou, Antonis, Soudris, Dimitrios, Radojcic, Riko (Eds.)

  • Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her work;
  • Provides a high-level (tutorial-like) description of 3D system integration that will cover issues ranging from process technology and manufacturing of 3D systems to the design of 3D components and entire systems
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eBook $99.00
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  • ISBN 978-1-4419-0962-6
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Hardcover $129.00
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  • ISBN 978-1-4419-0961-9
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Softcover $129.00
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  • ISBN 978-1-4899-8182-0
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About this book

Three Dimensional System Integration: IC Stacking From Process Technology to System Design Edited by: Antonis Papanikolaou Dimitrios Soudris Riko Radojcic Three-dimensional (3D) integrated circuit (IC) stacking enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides an overview of the entire trajectory from basic process technology issues to the design at the system level of three dimensionally integrated nano-electronic systems. Physical design and design at the architecture and system level are emphasized in this book, since the technology has matured to the point that these issues have become very important. This book is intended for an audience with a basic grasp of electrical engineering concepts including some familiarity with fabrication of semiconductor devices, Very Large Scale Integration (VLSI) and computer architecture. •Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her work; •Provides a high-level (tutorial-like) description of 3D system integration that will cover issues ranging from process technology and manufacturing of 3D systems to the design of 3D components and entire systems; •First book to offer not only a high-level view of the entire field of 3D integration, but also an understanding of the interactions between the various phases of design and manufacturing.

Table of contents (10 chapters)

  • Introduction to Three-Dimensional Integration

    Papanikolaou, Antonis (et al.)

    Pages 1-12

  • TSV-Based 3D Integration

    Burns, James

    Pages 13-32

  • TSV Characterization and Modeling

    Stucchi, Michele (et al.)

    Pages 33-49

  • Homogeneous 3D Integration

    Patti, Robert

    Pages 51-71

  • 3D Physical Design

    Cong, Jason (et al.)

    Pages 73-100

Buy this book

eBook $99.00
price for USA (gross)
  • ISBN 978-1-4419-0962-6
  • Digitally watermarked, DRM-free
  • Included format: PDF, EPUB
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $129.00
price for USA
  • ISBN 978-1-4419-0961-9
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $129.00
price for USA
  • ISBN 978-1-4899-8182-0
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Three Dimensional System Integration
Book Subtitle
IC Stacking Process and Design
Editors
  • Antonis Papanikolaou
  • Dimitrios Soudris
  • Riko Radojcic
Copyright
2011
Publisher
Springer US
Copyright Holder
Springer Science+Business Media, LLC
eBook ISBN
978-1-4419-0962-6
DOI
10.1007/978-1-4419-0962-6
Hardcover ISBN
978-1-4419-0961-9
Softcover ISBN
978-1-4899-8182-0
Edition Number
1
Number of Pages
VIII, 246
Topics