Overview
- Covers the entire range of 3D chip stacking topics in such a way that a non-expert (in 3D integration) reader can understand exactly what this technology is, why it is beneficial, how it changes conventional practices and how it can affect his/her work;
- Provides a high-level (tutorial-like) description of 3D system integration that will cover issues ranging from process technology and manufacturing of 3D systems to the design of 3D components and entire systems
- Includes supplementary material: sn.pub/extras
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Table of contents (10 chapters)
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Front Matter
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Back Matter
Keywords
About this book
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.
This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Editors and Affiliations
Bibliographic Information
Book Title: Three Dimensional System Integration
Book Subtitle: IC Stacking Process and Design
Editors: Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic
DOI: https://doi.org/10.1007/978-1-4419-0962-6
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer Science+Business Media, LLC 2011
Hardcover ISBN: 978-1-4419-0961-9Published: 15 December 2010
Softcover ISBN: 978-1-4899-8182-0Published: 02 September 2014
eBook ISBN: 978-1-4419-0962-6Published: 07 December 2010
Edition Number: 1
Number of Pages: VIII, 246