Thermal Testing of Integrated Circuits

Authors: Altet, Josep, Rubio, Antonio

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About this book

Integrated circuits (IC's) have undergone a significant evolution in terms of complexity and performance as a result 'of the substantial advances made in manufacturing technology. Circuits, in their various mixed formats, can be made up tens or even hundreds of millions of devices. They work at extremely low voltages and switch at very high frequencies. Testing of circuits has become an essential process in IC manufacturing, in the effort to ensure that the manufactured components have the appropriate levels of quality. Along with the ongoing trend towards more advanced technology and circuit features, major testing challenges are continuously emerging. The use of ambivalent procedures to test the analogue and digital sections of such complex circuits without interfering in their nominal operation is clearly a critical part of today's technological ipdustries. Chapter 1 presents the general purposes and basic concepts rel~ted With' the"testing of integrated circuits, discussing the various strategies and their limitations. Readers who are already familiar with the field may opt to skip this chapter. This book offers a multidisciplinary focus on thermal testing. This is a testing method which is not only suitable for use in combination with other existing techniques, but is also backed by a wealth of knowledge and offers exciting opportunities in the form of as yet unexplored areas of research and innovation for industrial applications.

Table of contents (6 chapters)

  • Introduction to the testing of integrated circuits

    Altet, Josep (et al.)

    Pages 1-21

  • Thermal transfer and thermal coupling in IC’s

    Altet, Josep (et al.)

    Pages 23-51

  • Thermal analysis in integrated circuits

    Altet, Josep (et al.)

    Pages 53-96

  • Temperature as a test observable variable in ICs

    Altet, Josep (et al.)

    Pages 97-138

  • Thermal monitoring of IC’s

    Altet, Josep (et al.)

    Pages 139-183

Buy this book

eBook $89.00
price for USA (gross)
  • ISBN 978-1-4757-3635-9
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $119.00
price for USA
  • ISBN 978-1-4020-7076-1
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $119.00
price for USA
  • ISBN 978-1-4419-5287-5
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Thermal Testing of Integrated Circuits
Authors
Copyright
2002
Publisher
Springer US
Copyright Holder
Springer Science+Business Media Dordrecht
eBook ISBN
978-1-4757-3635-9
DOI
10.1007/978-1-4757-3635-9
Hardcover ISBN
978-1-4020-7076-1
Softcover ISBN
978-1-4419-5287-5
Edition Number
1
Number of Pages
XIV, 204
Number of Illustrations and Tables
102 b/w illustrations
Topics