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Table of contents (5 chapters)
Keywords
About this book
High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models.
High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.
Authors and Affiliations
Bibliographic Information
Book Title: High-Frequency Characterization of Electronic Packaging
Authors: Luc Martens
Series Title: Electronic Packaging and Interconnects
DOI: https://doi.org/10.1007/978-1-4615-5623-7
Publisher: Springer New York, NY
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eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media New York 1998
Hardcover ISBN: 978-0-7923-8307-9Published: 31 October 1998
Softcover ISBN: 978-1-4613-7573-9Published: 23 February 2014
eBook ISBN: 978-1-4615-5623-7Published: 27 November 2013
Series ISSN: 1389-2169
Edition Number: 1
Number of Pages: XII, 158
Topics: Microwaves, RF and Optical Engineering, Control, Robotics, Mechatronics, Electrical Engineering