Electronic Packaging and Interconnects

High-Frequency Characterization of Electronic Packaging

Authors: Martens, Luc

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eBook $109.00
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  • ISBN 978-1-4615-5623-7
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Hardcover $199.99
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  • ISBN 978-0-7923-8307-9
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Softcover $149.99
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About this book

High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems.
High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models.
High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.

Table of contents (5 chapters)

  • Electronic Packaging and High Frequencies

    Martens, Luc

    Pages 1-6

  • Electrical Description of Electronic Packaging

    Martens, Luc

    Pages 7-22

  • High-Frequency Measurement Techniques

    Martens, Luc

    Pages 23-63

  • High-Frequency Measurement Techniques for Electronic Packaging

    Martens, Luc

    Pages 65-96

  • Measurement-Based Modeling Algorithms

    Martens, Luc

    Pages 97-154

Buy this book

eBook $109.00
price for USA (gross)
  • ISBN 978-1-4615-5623-7
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $199.99
price for USA
  • ISBN 978-0-7923-8307-9
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
Softcover $149.99
price for USA
  • ISBN 978-1-4613-7573-9
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
High-Frequency Characterization of Electronic Packaging
Authors
Series Title
Electronic Packaging and Interconnects
Series Volume
1
Copyright
1998
Publisher
Springer US
Copyright Holder
Springer Science+Business Media New York
eBook ISBN
978-1-4615-5623-7
DOI
10.1007/978-1-4615-5623-7
Hardcover ISBN
978-0-7923-8307-9
Softcover ISBN
978-1-4613-7573-9
Series ISSN
1389-2169
Edition Number
1
Number of Pages
XII, 158
Topics