Overview
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About this book
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Bibliographic Information
Book Title: Chip On Board
Book Subtitle: Technology for Multichip Modules
Authors: John H. Lau
Publisher: Springer New York, NY
Copyright Information: Springer-Verlag US 1994
Hardcover ISBN: 978-0-442-01441-4Published: 30 June 1994
Edition Number: 1
Number of Pages: XX, 556
Topics: Control Structures and Microprogramming, Manufacturing, Machines, Tools, Processes, Processor Architectures