Multichip Module Technologies and Alternatives: The Basics

Authors: Doane, Daryl Ann, Franzon, Paul

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About this book

Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to improve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.

Table of contents (18 chapters)

  • Introduction

    Doane, Daryl Ann

    Pages 3-36

  • MCM Package Selection: A Materials and Manufacturing Perspective

    Dixon, Allison Casey (et al.)

    Pages 37-86

  • MCM Package Selection: A Systems Need Perspective

    Franzon, Paul D.

    Pages 87-131

  • MCM Package Selection: Cost Issues

    Ng, Lee Hong

    Pages 133-164

  • Laminate-Based Technologies for Multichip Modules

    Higgins, Leo M.

    Pages 169-213

Buy this book

eBook $219.00
price for USA (gross)
  • ISBN 978-1-4615-3100-5
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $279.00
price for USA
  • ISBN 978-0-442-01236-6
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Multichip Module Technologies and Alternatives: The Basics
Authors
Copyright
1993
Publisher
Springer US
Copyright Holder
Springer Science+Business Media New York
eBook ISBN
978-1-4615-3100-5
DOI
10.1007/978-1-4615-3100-5
Hardcover ISBN
978-0-442-01236-6
Edition Number
1
Number of Pages
XXXII, 875
Topics