Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

Editors: Shacham-Diamand, Y., Osaka, T., Datta, M., Ohba, T. (Eds.)

  • The multidisciplinarity of this book makes it an especially valuable tool for those interested in ULSI Interconnects

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eBook $199.00
price for USA (gross)
  • ISBN 978-0-387-95868-2
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About this book

Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews the basic technologies used today for the copper metallization of ULSI applications: deposition and planarization. It describes the materials used, their properties, and the way they are all integrated, specifically in regard to the copper integration processes and electrochemical processes in the nanoscale regime. The book also presents various novel nanoscale technologies that will link modern nanoscale electronics to future nanoscale based systems. This diverse, multidisciplinary volume will appeal to process engineers in the microelectronics industry; universities with programs in ULSI design, microelectronics, MEMS and nanoelectronics; and professionals in the electrochemical industry working with materials, plating and tool vendors.

Table of contents (35 chapters)

  • Challenges in ULSI Interconnects - Introduction to the Book

    Shacham-Diamand, Y.

    Pages 3-11

  • MOS Device and Interconnects Scaling Physics

    Rossum, Marc

    Pages 15-38

  • Interconnects in ULSI Systems: Cu Interconnects Electrical Performance

    Kolodny, Avinoam

    Pages 39-62

  • Electrodeposition

    Datta, Madhav

    Pages 63-71

  • Electrophoretic Deposition

    Brandon, David

    Pages 73-78

Buy this book

eBook $199.00
price for USA (gross)
  • ISBN 978-0-387-95868-2
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
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Bibliographic Information

Bibliographic Information
Book Title
Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
Editors
  • Yosi Shacham-Diamand
  • Tetsuya Osaka
  • Madhav Datta
  • Takayuki Ohba
Copyright
2009
Publisher
Springer-Verlag New York
Copyright Holder
Springer-Verlag New York
eBook ISBN
978-0-387-95868-2
DOI
10.1007/978-0-387-95868-2
Edition Number
1
Number of Pages
XX, 552
Topics