Editors:
- Provides a comprehensive summary of the most recent advances in materials development for advanced packaging
- Covers emerging technologies such as digital health, bio-medical, and nano-materials / processing, in addition to microelectronic and optoelectronic packaging
- Discusses various types of materials including polymers, ceramics, metals, and solders
- Each chapter written by industry leaders
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Table of contents (19 chapters)
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Front Matter
About this book
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Editors and Affiliations
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Henkel Locite Co., Ltd. Yantai, Shandong, P.R., China
Daniel Lu
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Georgia Institute of Technology, Atlanta, USA
C.P. Wong
Bibliographic Information
Book Title: Materials for Advanced Packaging
Editors: Daniel Lu, C.P. Wong
DOI: https://doi.org/10.1007/978-0-387-78219-5
Publisher: Springer New York, NY
eBook Packages: Chemistry and Materials Science, Chemistry and Material Science (R0)
Copyright Information: Springer-Verlag US 2009
Hardcover ISBN: 978-0-387-78218-8Published: 10 December 2008
eBook ISBN: 978-0-387-78219-5Published: 17 December 2008
Edition Number: 1
Number of Pages: XII, 724
Number of Illustrations: 300 b/w illustrations
Topics: Optical and Electronic Materials, Metallic Materials, Nanotechnology, Electronics and Microelectronics, Instrumentation