Materials for Advanced Packaging

Editors: Lu, Daniel, Wong, C.P. (Eds.)

  • Provides a comprehensive summary of the most recent advances in materials development for advanced packaging
  • Covers emerging technologies such as digital health, bio-medical, and nano-materials/processing, in addition to microelectronic and optoelectronic packaging
  • Discusses various types of materials including polymers, ceramics, metals, and solders
  • Each chapter written by industry leaders
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Buy this book

eBook $109.00
price for USA (gross)
valid through November 5, 2017
  • ISBN 978-0-387-78219-5
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $149.00
price for USA
valid through November 5, 2017
  • ISBN 978-0-387-78218-8
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
About this book

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects.

This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including:

New bonding and joining techniques

Novel approaches to make electrical interconnects between integrated circuit (IC) and substrates

Latest advances in packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives.

Materials and processing aspects on MEMS and wafer level chip scale packaging.

Written by experts in the field of materials and packaging, Materials for Advanced Packaging is a must have book for professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science and engineering.

Table of contents (19 chapters)

  • 3D Integration Technologies – An Overview

    Chanchani, Rajen

    Pages 1-50

  • Advanced Bonding/Joining Techniques

    Lee, Chin C. (et al.)

    Pages 51-76

  • Advanced Chip-to-Substrate Connections

    Kohl, Paul A. (et al.)

    Pages 77-112

  • Advanced Wire Bonding Technology: Materials, Methods, and Testing

    Charles, Harry K.

    Pages 113-179

  • Lead-Free Soldering

    Lee, Ning Cheng

    Pages 181-218

Buy this book

eBook $109.00
price for USA (gross)
valid through November 5, 2017
  • ISBN 978-0-387-78219-5
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover $149.00
price for USA
valid through November 5, 2017
  • ISBN 978-0-387-78218-8
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
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Bibliographic Information

Bibliographic Information
Book Title
Materials for Advanced Packaging
Editors
  • Daniel Lu
  • C.P. Wong
Copyright
2009
Publisher
Springer US
Copyright Holder
Springer-Verlag US
eBook ISBN
978-0-387-78219-5
DOI
10.1007/978-0-387-78219-5
Hardcover ISBN
978-0-387-78218-8
Edition Number
1
Number of Pages
XII, 724
Number of Illustrations and Tables
300 b/w illustrations
Topics