Authors:
- Identifies defects in traditional at-speed test methods
- Proposes new techniques and methodologes to improve the overall quality of transition fault tests
- Includes discussion of the effects of IR-drop
- Provides an introduction to path delay and transition delay fault models and test methods
- Includes supplementary material: sn.pub/extras
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Table of contents (12 chapters)
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Front Matter
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Back Matter
About this book
Adopting new fabrication technologies not only provides higher integration and enhances performance, but also increases the types of manufacturing defects. With design size in millions of gates and working frequency in GHz timing-related defects havv become a high proportion of the total chip defects. For nanometer technology designs, the stuck-at fault test alone cannot ensure a high quality level of chips. At-speed tests using the transition fault model has become a requirement in technologies below 180nm.
Traditional at-speed test methods cannot guarantee high quality test results as they face many new challenges. Supply noise (including IR-drop, ground bounce, and Ldi/dt) effects on chip performance, high test pattern volume, low fault/defect coverage, small delay defect test pattern generation, high cost of test implementation and application, and utilizing low-cost testers are among these challenges. This book discusses these challenges in detail and proposes new techniques and methodologies to improve the overall quality of the transition fault test.
Authors and Affiliations
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Electrical and Computer Engineering, University of Connecticut, Storrs, USA
Mohammad Tehranipoor
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Texas Instruments, Austin, USA
Nisar Ahmed
Bibliographic Information
Book Title: Nanometer Technology Designs
Book Subtitle: High-Quality Delay Tests
Authors: Mohammad Tehranipoor, Nisar Ahmed
DOI: https://doi.org/10.1007/978-0-387-75728-5
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer-Verlag US 2008
Hardcover ISBN: 978-0-387-76486-3Published: 20 December 2007
Softcover ISBN: 978-1-4419-4559-4Published: 14 December 2011
eBook ISBN: 978-0-387-75728-5Published: 26 February 2010
Edition Number: 1
Number of Pages: XVIII, 281
Number of Illustrations: 140 b/w illustrations
Topics: Circuits and Systems, Electronics and Microelectronics, Instrumentation, Computer-Aided Engineering (CAD, CAE) and Design, Nanotechnology, Electrical Engineering