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Technology of III-V, II-VI, and Non-Tetrahedrally Bonded Compounds / Technologie der III-VI, II-VI und nicht-tetraedrisch gebundenen Verbindungen

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Overview

Authors:
  1. J. Baars
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  2. P. Glasgow
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  3. R. Helbig
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  4. H. Jacob
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  5. K. Kassel
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  6. H. Maier
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  7. G. Müller
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  8. H. Runge
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  9. M. Schulz
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  10. E. Tomzig
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  11. C. Weyrich
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Editors:
  1. M. Schulz
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  2. H. Weiss
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Part of the book series: Landolt-Börnstein: Numerical Data and Functional Relationships in Science and Technology - New Series (LANDOLT 3, volume 17d)

Part of the book sub series: Condensed Matter (LANDOLT 3)

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Keywords

  • Halbleiter
  • semiconductor

Bibliographic Information

  • Book Title: Technology of III-V, II-VI, and Non-Tetrahedrally Bonded Compounds / Technologie der III-VI, II-VI und nicht-tetraedrisch gebundenen Verbindungen

  • Authors: J. Baars, P. Glasgow, R. Helbig, H. Jacob, K. Kassel, H. Maier, G. Müller, H. Runge, M. Schulz, E. Tomzig, … C. Weyrich

  • Editors: M. Schulz, H. Weiss

  • Series Title: Landolt-Börnstein: Numerical Data and Functional Relationships in Science and Technology - New Series

  • Publisher: Springer Berlin, Heidelberg

  • Copyright Information: Springer-Verlag Berlin Heidelberg 1984

  • Hardcover ISBN: 978-3-540-11779-7Due: 01 November 1984

  • eBook ISBN: 978-3-540-39485-3

  • Series ISSN: 1615-1844

  • Series E-ISSN: 1616-9522

  • Edition Number: 1

  • Number of Pages: 429

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