Springer eBooks may be purchased by end-customers only and are sold without copy protection (DRM free). Instead, all eBooks include personalized watermarks. This means you can read the Springer eBooks across numerous devices such as Laptops, eReaders, and tablets.
You can pay for Springer eBooks with Visa, Mastercard, American Express or Paypal.
After the purchase you can directly download the eBook file or read it online in our Springer eBook Reader. Furthermore your eBook will be stored in your MySpringer account. So you can always re-download your eBooks.
(net)
price for USA
ISBN 978-1-4614-1508-4
digitally watermarked, no DRM
Included Format: PDF
download immediately after purchase
Hardcover version
You can pay for Springer Books with Visa, Mastercard, American Express or Paypal.
Standard shipping is free of charge for individual customers.
(net)
price for USA
ISBN 978-1-4614-1507-7
free shipping for individuals worldwide
usually dispatched within 3 to 5 business days
Softcover (also known as softback) version.
You can pay for Springer Books with Visa, Mastercard, American Express or Paypal.
Standard shipping is free of charge for individual customers.
(net)
price for USA
ISBN 978-1-4899-9510-0
free shipping for individuals worldwide
usually dispatched within 3 to 5 business days
This introductory and self-contained book gathers as much explicit mathematical results on the linear-elastic and heat-conduction solutions in the neighborhood of singular points in two-dimensional domains, and singular edges and vertices in three-dimensional domains. These are presented in an engineering terminology for practical usage. The author treats the mathematical formulations from an engineering viewpoint and presents high-order finite-element methods for the computation of singular solutions in isotropic and anisotropic materials, and multi-material interfaces. The proper interpretation of the results in engineering practice is advocated, so that the computed data can be correlated to experimental observations.
The book is divided into fourteen chapters, each containing several sections. Most of it (the first nine Chapters) addresses two-dimensional domains, where only singular points exist. The solution in a vicinity of these points admits an asymptotic expansion composed of eigenpairs and associated generalized flux/stress intensity factors (GFIFs/GSIFs), which are being computed analytically when possible or by finite element methods otherwise. Singular points associated with weakly coupled thermoelasticity in the vicinity of singularities are also addressed and thermal GSIFs are computed. The computed data is important in engineering practice for predicting failure initiation in brittle materials on a daily basis. Several failure laws for two-dimensional domains with V-notches are presented and their validity is examined by comparison to experimental observations. A sufficient simple and reliable condition for predicting failure initiation (crack formation) in micron level electronic devices, involving singular points, is still a topic of active research and interest, and is addressed herein.
Explicit singular solutions in the vicinity of vertices and edges in three-dimensional domains are provided in the remaining five chapters. New methods for the computation of generalized edge flux/stress intensity functions along singular edges are presented and demonstrated by several example problems from the field of fracture mechanics; including anisotropic domains and bimaterial interfaces. Circular edges are also presented and the author concludes with some remarks on open questions.
This well illustrated book will appeal to both applied mathematicians and engineers working in the field of fracture mechanics and singularities.
Content Level » Research
Keywords » Continuum Mechanics - Elasticity - Elliptic Boundary problems - Finite Element Methods
Related subjects » Computational Intelligence and Complexity - Computational Science & Engineering - Mechanics
Get alerted on new Springer publications in the subject area of Computational Mathematics and Numerical Analysis.