Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators

1. Front Matter

   Pages i-x

   PDF

2. MEMS/NEMS Technologies and Applications

   1. Front Matter

      Pages 1-1

      PDF

   2. History of Early Research on MEMS in Russia (U.S.S.R.)

      • Vladimir Vaganov

      Pages 3-15

   3. Challenges of Complete CMOS/MEMS Systems Integration

      • Vladimir Vaganov

      Pages 17-30

   4. MEMS for Practical Applications

      • Masayoshi Esashi

      Pages 31-40

   5. Nanochip: A MEMS-Based Ultra-High Data Density Memory Device

      • Nickolai Belov, Donald Adams, Peter Ascanio, Tsung-Kuan Chou, John Heck, Byong Kim et al.

      Pages 41-65

   6. Low Cost Silicon Coriolis’ Gyroscope Paves the Way to Consumer IMU

      • Benedetto Vigna, Fabio Pasolini, Roberto de Nuccio, Macro Capovilla, Luciano Prandi, Fabio Biganzoli

      Pages 67-74

   7. Microwave and Millimetre Wave Devices Based on Micromachining of III-V Semiconductors

      • Alexandru Müller, Dan Neculoiu, George Konstantinidis, Tauno Vähä-Heikilä

      Pages 75-87

   8. Monocrystalline-Silicon Microwave MEMS Devices

      • Joachim Oberhammer, Mikael Sterner, Nutapong Somjit

      Pages 89-100

   9. Three-Dimensional Photonic Crystals Based on Opal-Semiconductor and Opal-Metal Nanocomposites

      • Valery G. Golubev

      Pages 101-113

3. MEMS Device and Reliability Physics

   1. Front Matter

      Pages 116-116

      PDF

   2. Pull-in Dynamics of Electrostatically Actuated Bistable Micro Beams

      • Slava Krylov, Nir Dick

      Pages 117-128

   3. Path Following and Numerical Continuation Methods for Non-Linear MEMS and NEMS

      • Peter G. Steeneken, Jiri Stulemeijer

      Pages 129-140

   4. The Impact of Dielectric Material and Temperature on Dielectric Charging in RF MEMS Capacitive Switches

      • George Papaioannou

      Pages 141-153

4. Advanced Processes and Materials

   1. Front Matter

      Pages 156-156

      PDF

   2. Development of DRIE for the Next Generation of MEMS Devices

      • H. Ashraf, J. Hopkins, L. M. Lea

      Pages 157-165

   3. Low-Temperature Processes for MEMS Device Fabrication

      • Jyrki Kiihamäki, Hannu Kattelus, Martti Blomberg, Riikka Puurunen, Mari Laamanen, Panu Pekko et al.

      Pages 167-178

   4. High-Temperature Stable Au–Sn and Cu–Sn Interconnects for 3D Stacked Applications

      • Nils Hoivik, He Liu, Kaiying Wang, Guttorm Salomonsen, Knut Aasmundtveit

      Pages 179-190

   5. 3D Integration of MEMS and IC: Design, Technology and Simulations

      • Maaike M. V. Taklo, Kari SchjøLberg-Henriksen, Nicolas Lietaer, Josef Prainsack, Anders Elfving, Josef Weber et al.

      Pages 191-203

   6. Low-Frequency Electronic Noise in the Back-Gated and Top-Gated Graphene Devices

      • Guanxiong Liu, Qinghui Shao, Alexander A. Balandin, William Stillman, Michal Shur, Sergey Rumyantsev

      Pages 205-214

A NATO Advanced Research Workshop (ARW) entitled “Advanced Materials and Technologies for Micro/Nano Devices, Sensors and Actuators” was held in St. Petersburg, Russia, from June 29 to July 2, 2009. The main goal of the Workshop was to examine (at a fundamental level) the very complex scientific issues that pertain to the use of micro- and nano-electromechanical systems (MEMS and NEMS), devices and technologies in next generation commercial and defen- related applications. Micro- and nano-electromechanical systems represent rather broad and diverse technological areas, such as optical systems (micromirrors, waveguides, optical sensors, integrated subsystems), life sciences and lab equipment (micropumps, membranes, lab-on-chip, membranes, microfluidics), sensors (bio-sensors, chemical sensors, gas-phase sensors, sensors integrated with electronics) and RF applications for signal transmission (variable capacitors, tunable filters and antennas, switches, resonators). From a scientific viewpoint, this is a very multi-disciplinary field, including micro- and nano-mechanics (such as stresses in structural materials), electronic effects (e. g. charge transfer), general electrostatics, materials science, surface chemistry, interface science, (nano)tribology, and optics. It is obvious that in order to overcome the problems surrounding next-generation MEMS/NEMS devices and applications it is necessary to tackle them from different angles: theoreticians need to speak with mechanical engineers, and device engineers and modelers to listen to surface physicists. It was therefore one of the main objectives of the workshop to bring together a multidisciplinary team of distinguished researchers.

• CMOS
• integrated circuit
• metal
• microelectromechanical system (MEMS)
• semiconductor
• sensor
• static-induction transistor

• Qualcomm MEMS Technologies, Inc., San Jose, USA

  Evgeni Gusev

• Inst. Advanced Materials Devices &, Nanotechnology, Rutgers University, Piscataway, USA

  Eric Garfunkel

• A.E Ioffe Physico-Technical Institute, Russian Academy of Sciences, St. Petersburg, Russian Federation

  Arthur Dideikin

Policies and ethics