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Rapid Thermal Processing of Semiconductors

  • Book
  • © 1997

Overview

Part of the book series: Microdevices (MDPF)

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Table of contents (7 chapters)

Keywords

About this book

Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.

Authors and Affiliations

  • Belarussian State University of Informatics and Radioelectronics, Minsk, Republic of Belarus

    Victor E. Borisenko

  • The University of Illinois at Chicago, Chicago, USA

    Peter J. Hesketh

Bibliographic Information

  • Book Title: Rapid Thermal Processing of Semiconductors

  • Authors: Victor E. Borisenko, Peter J. Hesketh

  • Series Title: Microdevices

  • DOI: https://doi.org/10.1007/978-1-4899-1804-8

  • Publisher: Springer New York, NY

  • eBook Packages: Springer Book Archive

  • Copyright Information: Springer Science+Business Media New York 1997

  • Hardcover ISBN: 978-0-306-45054-9Published: 31 May 1997

  • Softcover ISBN: 978-1-4899-1806-2Published: 20 June 2013

  • eBook ISBN: 978-1-4899-1804-8Published: 22 November 2013

  • Edition Number: 1

  • Number of Pages: XXII, 358

  • Topics: Optical and Electronic Materials, Solid State Physics, Spectroscopy and Microscopy

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