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Materials - Nanotechnology | Bio and Nano Packaging Techniques for Electron Devices - Advances in Electronic Device Packaging

Bio and Nano Packaging Techniques for Electron Devices

Advances in Electronic Device Packaging

Gerlach, Gerald, Wolter, Klaus-Jürgen (Eds.)

2012, XII, 628 p.

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  • Provides solutions for electron device packaging
  • Comprehensive review of nanoscale materials for packaging
  • Lists the future trends in nanobiotechniques

The book offers a comprehensive discussion of future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes effects of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their opportunities for packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed and also shows ways for implementation. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces are demonstrated. Also new packaging technologies with high potential for industrial applications like nano partical fabrication and application, nano imprinting and ink-jet printing are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers as well as practicing engineers seeking information about the latest nano and bio techniques in packaging.

Content Level » Research

Keywords » 3D Modelling - Bio-Functionalized Surfaces - Biocompatible Packaging - MEMS - MOEMS - Metallization - NEMS - Nano-Functionalized Surfaces - Nanoparticles - Nanopattering - Thermal Management

Related subjects » Characterization & Evaluation of Materials - Nanotechnology - Optical & Electronic Materials

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